Kabushiki Kaisha Toshiba

Toshiba Lighting & Technology Corporation

Michinobu Inoue

Makoto Sakai

Susumu Obata

Izuru Komatsu

Kazuhito Higuchi

Kazuo Shimokawa

Tomohiro Iguchi

Akihiko Happoya

Takeshi Miyagi

Daigo Suzuki

Hideo Nishiuchi

Kazuki Tateyama

Takumi Suwa

Hisashi Ito

Takashi Koyanagawa

Kumiko Ioka

Yoshiaki Sugizaki

Junichiro Yamamoto

Shigeru Motoki

Toshitake Kitagawa

Shinji Nakata

Yasuhide Okada

Koki Moriya

According to one embodiment, an information processing system includes a memory, an inputter, and a processor. The memory stores correlation information including a specification item group, an element item group, and a risk item group. The specification item group includes specification items. The element item group includes element items. The risk item group includes risk items. One of the specification items to be modified is selected by a first operation input to the inputter. One of the element items is selected by a second operation input to the inputter. When the first operation is input, the processor refers to the correlation information and extracts at least one of the element items having a correlation with the one of the specification items. The processor extracts at least one of the risk items having a correlation with one element item of the at least one of the element items selected.

Information processing system and information processing method

A lighting apparatus includes a case, a power source unit, and a light emitting unit. The case has a side portion provided around a first axis parallel to a direction from the power source unit toward the light emitting unit. The side portion has a first portion and a second portion disposed around a central axis parallel to the first axis. The first portion has a long distance to the central axis. The second portion has a short distance to the central axis. An end portion of an inner surface of the second portion is configured to have at least one selected from a portion perpendicular to the central axis and a portion has a recessed configuration with respect to the central axis when the inner surface is cut by a cross-section perpendicular to the central axis.

Lighting apparatus

A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.

Self-ballasted lamp and lighting fixture

A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

Luminaire

Light emitting diode lamp

An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

Optical semiconductor device and method of manufacturing optical semiconductor device

A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.

Micromechanical device and method of manufacturing micromechanical device

An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.

An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space.

Electric component

Growing community of inventors

Yokohama, Japan

Michinobu Inoue