Fujitsu Corporation

Fujitsu Component Limited

Michinao Nomura

Yoshiaki Yanagida

Hiroaki Tamura

Tomokazu Sugiyama

Koji Sudo

Fumihiko Tokura

Tsutomu Honma

Toshihiro Kusagaya

Kazuhiro Mizukami

Shunsuke Sone

Mitsuo Takeuchi

Toshinori Kasuga

Akihiko Ushimaru

Mitsuru Kubo

Chujiro Fukasawa

An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer.

Method of manufacturing electronic component lead using laser beam

An electronic component includes: an electronic component body; and a lead secured to the electric component and including a projection portion defined by first and second inclined portions facing each other. The solder wettability of the first inclined portion is smaller than the solder wettability of the second inclined portion.

Electronic component, board unit, and information-processing device

A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Cleaning apparatus and cleaning method

A light source emits a laser beam to the object through an output end. An optical system is placed between the output end and the object. The optical system adjusts the energy of the laser beam emitted, through the output end, onto a unit area for a unit time. The energy of the beam spot on the object enables cutting or bending of the object. The optical system serves to adjust the energy of the laser beam irradiated to the object. The energy of the laser beam instantly changes as compared with the case where the energy of the laser beam is adjusted based on a driving voltage applied to a laser oscillator. The object is thus processed by using the laser beam with high accuracy.

Processing apparatus and method of processing and method of making leaf spring

A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Cleaning/drying apparatus and cleaning/drying method

A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other.

Processing method and apparatus

Disclosed herein is a method including the steps of cutting a wafer to prepare a row block having a plurality of head elements arranged in a matrix, bonding a plate member to one side surface of the row block, bonding a row tool to another side surface of the row block bonded to the plate member opposite to the one side surface, and cutting the row block to prepare a row bar bonded to the row tool and having a row of the head elements. A bonding apparatus for realizing the above bonding steps is also disclosed.

Manufacturing method and apparatus for magnetic head sliders

A blade as an edged member having separated two forward ends is inserted into an opening of a holder as a U-shaped member, and a gap between the two forward ends of the inserted blade is widened so that a width of the opening is expanded, and a light guide body as a thin plate is inserted into the opening with expanded width, and after that the two forward ends of the blade are drawn from the opening.

Method of and apparatus for thin plate assembly, and computer product

A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw bars stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars, which are stripped off from the transfer tools and are placed on the base, from the top.

Raw bar stripping off and cleaning jig and raw bar stripping off and cleaning method

A raw bar stripping off and cleaning jig has a stripping-off member on which transfer tools are placed, a base for supporting raw ban to be stripped off from the transfer tools, a stripping-off suction member for attracting the raw bars to separate the same from the transfer tools, and a cover member for supporting the raw bars in the base after stripping.

Growing community of inventors

Kawasaki, Japan

Michinao Nomura