Fujitsu Corporation

Fujistu Limited

Michimasa Aoki

Masumi Suzuki

Jie Wei

Yosuke Tsunoda

Masuo Ohnishi

Mitsutaka Yamada

Masahiko Hattori

Keizou Takemura

Kenji Katsumata

Kenji Sasabe

Masayuki Watanabe

Fumihiro Tawa

Takeshi Nishiyama

Shunichi Kikuchi

Masaru Sugie

Shinichirou Kouno

Eiji Wajima

Yoshinori Uzuka

Tadanobu Matsumura

Hiroshi Muto

Hideki Kimura

Makoto Suwada

Nobumitsu Aoki

Takashi Urai

Shinichirou Okamoto

Wataru Nishiyama

An immersion tank includes a tank main body that includes a storage unit that stores a cooling liquid in which an electronic device is immersed, an upper part of the storage unit having an opening, a lid body that includes a top wall portion and a side wall portion, and is paired with the tank main body, and a gas-phase heat exchanger that cools a space between the storage unit and the top wall portion.

Immersion tank and electronic apparatus

An electronic device includes a housing filled with a liquid coolant, a first electronic device accommodated in the housing and immersed in the liquid coolant, a first heat sink provided with the first electronic device and exposed to the liquid coolant filled in the housing, a suction pipe configured to have an inlet that sucks the liquid coolant filled in the housing, a discharge pipe configured to have an outlet that faces the first heat sink via the liquid coolant filled in the housing and discharges the liquid coolant sucked from the inlet toward the first heat sink, and a pump provided in the housing to be coupled between the suction pipe and the discharge pipe, and configured to suck the liquid coolant from the inlet and discharge the liquid coolant from the outlet.

Electronic device

An electronic apparatus includes a housing, a heating component arranged inside the housing, a plurality of heat sinks arranged inside the housing, a heat transport member coupled such that heat is transferred from the heating component to the heat sinks, air intake regions positioned in the housing, corresponding to the respective heat sinks, and arranged below and close to the respective heat sinks, and an air exhaust region positioned in the housing and arranged above the heat sinks.

Electronic apparatus

An electronic apparatus includes a case, an electronic part housed in the case, and a heat sink coupled to the electronic part and at least partially arranged outside a side wall of the case with a gap formed between an outer peripheral portion of the heat sink and the side wall of the case.

A cooling jacket includes, a base having a portion that is in contact with a heat generating component, a plurality of grooves formed on a surface of the base, each of the plurality of grooves that is arranged in parallel each other, and a cover that is in contact with an upper end of each of fins formed by the plurality of grooves on the same plane as the surface of the base. Each of the plurality of grooves has curved bottom surfaces provided in both end portions thereof, and is shallower toward the end portions thereof. The cover is bonded to the base in a state of covering all of the plurality of grooves.

Cooling jacket and electronic apparatus

A heat receiver includes a first heat receiving body that includes a first flow path through which a coolant flows; and a second heat receiving body, provided on one side of the first heat receiving body, that includes a second flow path through which the coolant discharged from the first flow path flows. A flow path cross-sectional area of the second flow path is less than a flow path cross-sectional area of the first flow path so that the flow speed of the coolant is higher in the second flow path than in the first flow path, which enhances the cooling efficiency.

Heat receiver, cooling unit, and electronic device

An information processing apparatus is disclosed. The information processing apparatus includes a first heat emitting device and a heat exchanger. The heat exchanger includes a first layered structure of layers of a plurality of first flow channel members having one or more first flow channels formed therein for a first coolant that is liquid, a first header in fluid communication with the first flow channel members, a second layered structure of layers of a plurality of second flow channel members having one or more second flow channels formed therein for a second coolant that is liquid, and a second header in fluid communication with the second flow channel members. The first and the second layered structures are overlapped in a first region when viewed in a layered direction, and at least one of the first and the second layered structures has space between layers in a second region.

Information processing apparatus and heat exchanger

A semiconductor module includes: a container through which a refrigerant flows; a semiconductor device installed within the container and having an internal path through which the refrigerant flows; and a guide member installed within the container to adjust a first flow rate of the refrigerant flowing through the internal path, and a second flow rate of the refrigerant flowing outside the semiconductor device.

Semiconductor module and electronic device

An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage configured to include a flow path through which a cooling medium flows and be arranged above the mounting surface; and a cooler configured to be detachably coupled with the flow passage and cool the electronic component.

Information processing device and cooling unit

A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant to the plurality of pumps, a plurality of flow merging ports through which the coolant from the plurality of pumps merges, and a coolant outlet port; and a separating wall that is provided inside the casing and that separates the inside of the casing into a distribution chamber that is in communication with the inlet port and the branch ports, and a flow merging chamber that is in communication with the flow merging ports and the outlet port.

Coolant supply unit, cooling unit, and electronic device

A radiator includes: a tube through which a coolant flows; and a single tank including: a supplying chamber communicating with an end of the tube, for supplying the tube with the coolant; and a collecting chamber communicating with the other end of the tube, partitioned to the supplying chamber, and for collecting the coolant discharged from the tube.

Radiator and electronic device having the same

A heat exchanger includes: a plurality of first heat radiation members, each of the plurality of first heat radiation members including a first refrigerant flow path through which a refrigerant flows; a plurality of second heat radiation members, each of the plurality of second heat radiation members including a second refrigerant flow path through which the refrigerant flows; and a fin attached between the plurality of second heat radiation members, wherein an interval between the plurality of first heat radiation members is smaller than an interval between the plurality of second heat radiation members.

Heat exchanger, cooling unit, and electronic device

A cooling unit includes a tank having an inlet port and a discharge port for refrigerant, first and second radiators connected to the tank, the first and second radiators each having a flow path, an inlet chamber defined in the tank for supplying the refrigerant flowing therein from the inlet port to the first radiator, a discharge chamber defined in the tank for discharging the refrigerant cooled in the second radiator to the discharge port, and a reservoir in which bubbles generated in the refrigerant are collected, the reservoir being provided between the inlet chamber and the discharge chamber in the tank.

Cooling unit

A heat-receiver includes: a first plate that receives heat at one face from a heat generating body; a second plate that is disposed facing another face of the first plate with a spacing therebetween, and that has a greater plate thickness than a plate thickness of the first plate; a first coupling portion that couples together the first plate and the second plate; and a second coupling portion that couples together the first plate and the second plate at a position that faces across the first plate toward the heat generating body, with a gap between the second coupling portion and the first coupling portion through which a coolant is capable of passing, and that has a width along the other face of the first plate that is greater than a width of the first coupling portion, as viewed along the coolant passing direction.

Heat-receiver, cooling unit and electronic device

A substrate is disclosed, which can remove heat from a stacked body of semiconductor elements through a phase change of a coolant. The substrate of the application includes: a stacked body of semiconductor elements; a first channel forming a path, receiving circulation of a first coolant, in a surface of the stacked body; and a second channel forming a path, receiving circulation of a second coolant having a boiling point higher than the boiling point of the first coolant, in an inter-layer portion of the stacked body.

Growing community of inventors

Kawasaki, Japan

Michimasa Aoki