Hitachi Chemical Company, Ltd.

Michiko Natori

Toshiaki Tanaka

Dai Ishikawa

Shigeki Katogi

Hideo Nakako

Hiroki Hayashi

Shinichirou Sukata

Hiroshi Matsumoto

Aya Momozaki

Toshihiko Akahori

Takahiro Hidaka

Ken Sawabe

Tomoaki Aoki

Takuya Kajiwara

A silver paste composition comprising silver particles having a particle diameter of 0.1 &#x3bc;m to 20 &#x3bc;m, and a solvent, wherein the above-described solvent comprises a solvent having a boiling point of 300&#xb0; C. or more.

Silver paste composition and semiconductor device using same

An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass % or greater and the zinc atom content is from 0.01 mass % to 0.6 mass %, with respect to the total transition metal atoms in the solid portion of the adhesive composition.

Adhesive composition and semiconductor device using same

Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).

Solar cell module and method of manufacturing thereof

A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220&#xb0; C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring membersto electrodesconnected to a solar battery cell

Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module

An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.

Process for producing printed wiring board and photosensitive resin composition used in the same

A resist pattern having a film thickness of 1 to 100 &#x3bc;m and an aspect ratio (ratio of the line width to the film thickness of the resist pattern) of 3.5 or higher is provided in accordance with the present invention, the resist pattern being useful for increasing the density of a semiconductor package substrate circuit, and use of the resist pattern enabling a low conductor resistance to be maintained in fine wiring. This resist pattern can be produced using, for example, a photosensitive resin composition that includes (A) a binder polymer, (B1) a photopolymerizable compound having three ethylenically unsaturated bonds per molecule, (C) a photopolymerization initiator, and (D) either or both of a compound represented by general formula (I): (in the formula, m is an integer of 2 to 6) or a compound represented by general formula (II). 

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Tsukuba, Japan

Michiko Natori