Canon Kabushiki Kaisha

Michiko Johnson

Masahiro Kobayashi

Hiromasa Tsuboi

Yoichi Wada

Yuichiro Yamashita

Takeshi Ichikawa

Kiyofumi Sakaguchi

Shin Hasegawa

Takanori Suzuki

Masashi Kitani

Hirohide Munakata

Takayuki Kamimura

Hideyuki Itoh

A liquid ejection head includes a first substrate having a recessed portion, and a second substrate. An energy generating element that generates energy to eject liquid is in the recessed portion and is placed on a surface of the second substrate that faces the recessed portion. An electrode electrically connected to the energy generating element is formed in an end portion of the energy generating element. Among recessed portion side surfaces, a side surface of the recessed portion close to the electrode is inclined with respect to a joint surface between the first substrate and the second substrate. The end portion of the energy generating element close to the electrode, an end portion of the joint surface close to the electrode, and an end portion of a bottom surface of the recessed portion close to the electrode are located in sequence from a middle of the energy generating element.

Liquid ejection head and method of inspecting the liquid ejection head

A liquid ejection head includes an ejection-port defining member and a substrate having at least three liquid supply openings arranged in an array direction. The substrate has at least one groove in a region between ends of the liquid supply openings and an edge of the substrate. The groove extends from and communicates with the end of at least one of two outermost liquid supply openings of the liquid supply openings in the array direction. The groove extends at least to a position where the groove is superposed on the liquid supply opening next to the liquid supply opening communicating with the groove in an extending direction in which the liquid supply openings extend.

Liquid ejection head and method of testing for leaks in liquid supply openings of liquid ejection head

A liquid ejection head includes a plurality of flow paths. The plurality of flow paths includes a first flow path through which a first liquid flows and a second flow path disposed adjacent to the first flow path. A second liquid, having higher average spectral reflectance at a wavelength in a visible light region than the first liquid, flows through the second flow path. When pressure is applied to the first liquid, the pressure applied to the first liquid in the first flow path is lower than pressure applied to the second liquid in the second flow path.

Liquid ejection head, method of operating liquid ejecting head, and liquid ejection apparatus

A liquid ejection head that includes ejection orifices and is configured by bonding a silicon substrate and a support substrate, flow passages which penetrate a bonding surface between the silicon substrate and the support substrate and through which different types of liquids flow. An in-partition wall space that is open to the bonding surface between the silicon substrate and the support substrate is formed in a partition wall for separating the flow passages. The internal pressure of the in-partition wall space is set to be lower than pressure of the liquid on each of the flow passages.

Liquid ejection head, and liquid ejection device

An image pickup apparatus includes photoelectric conversion units each including a first semiconductor region of a first conductivity type and a semiconductor region of a second conductivity type disposed in contact with the first semiconductor region, a potential barrier formed between photoelectric conversion units, and a contact plug disposed in an image sensing area. The number of contact plugs is smaller than the number of photoelectric conversion units. The photoelectric conversion units include first and second photoelectric conversion units and are arranged such that at least two first photoelectric conversion units are adjacent in a first direction. The potential barrier includes a first part formed between the two first photoelectric conversion units disposed adjacently and a second part formed between first and second photoelectric conversion units adjacent to each other. The contact plug is located closer to the first part than to the second part.

Image pickup apparatus and image pickup system

A solid-state image capturing apparatus, comprising a plurality of photoelectric conversion portions disposed in a first semiconductor region of a first conductivity type, a first portion of the first conductivity type disposed in the first semiconductor region and configured to supply a first potential to the first semiconductor region, and a second semiconductor region of a second conductivity type configured to receive a second potential, wherein the first portion is disposed between first and second photoelectric conversion portions neighboring each other, and the second semiconductor region is disposed between the first portion and each of the first and second photoelectric conversion portions.

Solid-state image capturing apparatus and camera

An image capturing apparatus including a plurality of pixels arranged in a matrix and a signal processing unit configured to process signals read out from the pixels. In a first mode, a charge accumulation is controlled by an electronic shutter. In a second mode, the charge accumulation is controlled by a mechanical shutter. The signal processing unit corrects image data obtained from the plurality of pixels based on a signal obtained by the charge accumulation in the second mode.

Image capturing apparatus

An image pickup apparatus according to one or more embodiments includes a power line and first through fourth photodiodes. The first, second, and third photodiodes are arranged along a first direction so that the first photodiode is adjacent to the second photodiode, and the second photodiode is adjacent to the third photodiode. The power line includes a first conductor disposed along the first direction and a second conductor disposed along a second direction that intersects the first direction. The second conductor is disposed on a region between the second and third photodiodes. First and second transistors corresponding to the first and second photodiode, respectively, are connected to the power line. The fourth photodiode is disposed adjacent to the second photodiode in the second direction. A third transistor corresponding to the fourth photodiode is connected to the power line.

A display module includes a display panel, a unit disposed on an outer side of the display panel, and an adhesive sheet with which the display panel and the unit are stuck together. The adhesive sheet has a first adhesive surface adhering to the display panel and a second adhesive surface adhering to the unit. The edge of the first adhesive surface and the edge of the second adhesive surface are displaced from each other in the adhesive surface direction.

Display module

Provided is a display module in which the prevention of ambient light reflection and the protection of a mounting component may be provided in the same process using the same material, to thereby reduce the number of production steps, while preventing the display panel from increasing in size and thickness so that the cost of production may be reduced. The display module includes a display panel including a display element and a mounting component; a protective plate for protecting a display region of the display panel; and a covering material for integrally covering the display region of the display panel and the mounting component, the covering material being disposed between the display panel and the protective plate.

A touch panel includes a light guide including a first face for detecting the position of an object in contact therewith and a second face opposite the first face, and a line sensor for receiving light emitted from a side face of the light guide plate, wherein, of light irradiated from the second face side, the light guide guides toward the side face the portion of light reflected by the object.

Growing community of inventors

Machida, Japan

Michiko Johnson