Other

Nippon Oil Fats Co., Ltd.

Michihisa Yamada

Toshiaki Yamada

Kenji Endou

Yoshiyuki Yasukawa

Yasuo Moriya

Takeshi Takahashi

Hiroaki Hasegawa

Shigeru Asami

Hiroshi Ohmura

Yoshihiro Oshibe

Hisao Yamamoto

Tetsuya Itoh

Tomiho Yamada

The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.

Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same

The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom

The present block copolymer contains a structural unit (A) derived from a compound represented by the general formula (I): CH.sub.2 .dbd.CR.sub.1 COOR.sub.2 R.sub.f, and also contains a structural unit (B) consisting of a polymer moiety represented by at least one of the structural formulae (III) and (IV) and another polymer moiety derived from a compound represented by the general formula (II): CH.sub.2 .dbd.CR.sub.3 R.sub.4. For preparing the above block copolymer, a block copolymer consisting of the structural unit (A) derived from a compound represented by the general formula (I): CH.sub.2 .dbd.CR.sub.1 COOR.sub.2 R.sub.f and the structural unit (B1) derived from a compound represented by the general formula (II): CH.sub.2 .dbd.CR.sub.3 R.sub.4 and a compound represented by the general formula (V): CH.dbd.CR.sub.6 COO(R.sub.9).sub.t H are reacted with a compound represented by the general formula (VI): R.sub.10 COCl to allow a dehydrochlorination reaction to take place. Thus, an unsaturated group and fluorine containing block copolymer having excellent water and oil repellent properties and excellent sensitivity to activation energy rays can be prepared. The block copolymer is utilized as a surface modifier for activation energy-curing resins.

Unsaturated group and fluorine containing block copolymers, process for

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Aichi, Japan

Michihisa Yamada