Opnext Japan, Inc.

Oclaro Japan, Inc.

Lumentum Japan, Inc.

Hitachi, Ltd.

Michihide Sasada

Osamu Kagaya

Yukitoshi Okamura

Koki Iemura

Kazuhiro Komatsu

Hiroyasu Sasaki

Masanobu Okayasu

Hiroshi Yamamoto

Hiroshi Hamada

Hideyuki Kuwano

Takuma Ban

Hisashi Takamatsu

Naohiko Baba

Hideaki Asakura

Atsushi Miura

Tetsuya Aoki

Kenji Yoshimoto

Hiroyuki Arima

Tetsuya Kato

Yoshikuni Uchida

Koichiro Tonehira

Masato Shishikura

An optical receiver module includes: a lens array including a plurality of condenser lenses arranged in one direction to define a plane with optical axes in parallel to each other; and a light receiving element array including a plurality of light receiving elements each configured to receive light emitted from each of the condenser lenses. The light receiving element array includes: a semiconductor substrate to which the light from each of the condenser lenses is input and through which the light is transmitted; and light receiving portions each configured to receive the light transmitted through the semiconductor substrate and convert the light into an electrical signal. A shift of the optical axis of each of the condenser lenses from a center of each corresponding one of the light receiving portions is larger in a direction perpendicular to the one direction within the plane than in the one direction.

Optical receiver module having a shifted center axis of light receiving element

To provide an optical subassembly, an optical module, and an optical transmission equipment including simpler components. A first component with an optical semiconductor device mounted thereon that dissipates heat generated by the optical semiconductor device to outside, a second component in contact with the first component to form a box type housing, and a receptacle terminal that optically joined to the optical semiconductor device are provided, wherein the second component includes a window structure for transmitting light transmitted between the optical semiconductor device and the receptacle terminal, and the receptacle terminal is fused and fixed to the outside of the window structure.

Optical subassembly, optical module, and optical transmission equipment

There are provided an optical receiver module with an improvement in high frequency characteristic and reduction in size. The optical receiver module includes a substrate, an IC provided with two or more IC terminals, a light receiving element disposed in front of the IC, provided with two or more PD terminals and having a light receiving window, and a first optical component disposed in front of the IC provided with two bridge footing sections, and a lens main body section located between upper portions of the two bridge footing sections, the lens main body section is provided with a lens and a mirror, and a distance Lbetween a position A of the lens and a position B of the light receiving window is longer than a distance Lbetween the position B and a position C of an end part of the two bridge footing sections.

Optical receiver module, optical module, and optical transmission equipment

A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.

Optical module and flexible printed circuit board

High efficiency optical receiver module and optical transmitter module with multiple channels

An optical module includes a light-receiving element configured to convert an incident optical signal to an electric signal. The light-receiving element includes a mesa part configured to laminate at least a first semiconductor layer, a light absorption semiconductor layer that absorbs an optical signal entering from a light reception surface, and a second semiconductor layer. The light-receiving element also includes an electrode part disposed on a top of the mesa part and a wiring part that covers a part of a side surface of the mesa part. The optical module includes a lens configured to condense an optical signal from an optical fiber onto the light reception surface. The wiring part is disposed at a position based on an intensity distribution of the optical signal on the light reception surface.

Optical module having at least one light receiving element with a wiring part covers a part of a side surface of a mesa part

Provided is an optical receiver module capable of suppressing an increase, which is caused by tolerance of angle occurring at a time of manufacturing, in an amount of reflected return light that enters into an optical fiber while ensuring light-receiving efficiency. The light-receiving element () is arranged so that directions of the lines, which extend along the edges contained in a surface of the light-receiving element () on a side of the light-receiving-element support member (), and which intersect with the region surrounded by a straight line corresponding to the incident direction of the light, a straight line corresponding to a direction of the optical axis of the optical fiber (), and a supporting surface of the light-receiving-element support member () for supporting the light-receiving element (), correspond to the directions different from the directions orthogonal to the incident direction of the light.

Optical receiver module and manufacturing method with a shifted and angled light receiving element

Provided are an optical receptacle capable of manufacturing an optical module thereby, while suppressing a manufacturing cost, preventing a quality degradation, and suppressing a quantity of returning light by reflection. In the optical receptacle, a recess for receiving a lens and a lens support and a through-hole penetrating from a bottom of the recess toward an exterior are formed, and the recess is formed so that an inner peripheral surface of the recess is fixed to a desired position with respect to an outer peripheral surface of the lens support, in a case where the lens and the lens support are received in the recess such that an optical axis of the lens and an optical axis of the optical fiber to be inserted into the through hole are deviated from each other.

Optical receptacle, optical module, and method of manufacturing an optical module

A metal pattern for a high frequency signal is patterned on a flexile substrate, and the flexile substrate is bent in such a way as to form a substantially right angle at a spot corresponding to an end of the metal pattern for the signal. And an end of the metal pattern is fixedly attached to a lead pin for signaling, attached to a stem, for electrical continuity, so as to be in a posture horizontal with each other. Meanwhile, a part of the lead pins attached to the stem, being in such a state as penetrated through respective holes provided in the flexible substrate, is fixedly attached to a part of metal patterns provided on the flexible substrate so as to ensure electrical continuity therebetween.

Optical semiconductor device with flexible substrate

A semiconductor chip on which a light receiving element is mounted, a preamplifier for amplifying an output signal from the light receiving element, and an insulating carrier substrate on which the light receiving element is mounted are connected such that the output signal from the light receiving element is input to the preamplifier through electrodes on the carrier substrate, and there are provided two electrodes, on the carrier substrate, having a capacitance value of 40 fF or more therebetween in a state where no light receiving element is mounted.

Optical receiver module

The optical module comprises a device mounted with a photoelectric element and a receptacle to optically connect this device and an optical fiber is provided. The receptacle comprises a device holder at its one end, allows the device holder to be fitted to the top end side of the device, and fixed and held through the interposition of the ultraviolet curing resin. The device holder comprises a window area relatively large in an amount of ultraviolet transmission dispersedly arranged on the entire periphery of the fitted portion with the device.

Optical module having improved access to ultraviolet curing light

There is provided an optical receiver in which, between an optical receiver sub-assembly and a pre-amplifier on a main printed circuit board, two transmission lines on a flexible printed circuit board for connecting an optical receiver module with the main printed circuit board, a balanced-type attenuator circuit composed of four resistor elements, and two capacitor elements connected in parallel with the balanced-type attenuator circuit are provided.

Optical receiver

A photodetector module that can achieve impedance matching and power saving. A photodetector () and an amplifier () for amplifying an electric signal from the photodetector () are mounted on a stem (). A dielectric plate () is arranged between the stem () and a flexible substrate (). To transfer an electric signal from the amplifier () to the substrate (), a lead pin () is provided to pass through the stem () and the dielectric plate (). The output of the amplifier () includes a capacitance component, and the output impedance of the amplifier () is higher than the impedance that matches with the substrate (). Further, the thickness d of the dielectric plate () is such that the inductance component of the lead pin () includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate () can be achieved.

Photodetector module with impedance matching

The present invention provides an optical modulator module comprising: a chip carrier; a semiconductor optical modulator for modulating light based on an electronic signal; a strip conductor electrically connected to the semiconductor optical modulator; a first resistor electrically connected to the semiconductor optical modulator; and a second resistor electrically connected in series to the first resistor; wherein the semiconductor optical modulator, the strip conductor, and the first and second resistors are disposed on the chip carrier; and wherein the frequency characteristics of the optical modulator module is adjusted by selecting to short or not to short both ends of the first resistor by use of a wire as necessary.

Optical modulator module

To provide economical high-speed optical communications through an optical module a silicon substrate with a ball lens and semiconductor luminescence element mounted thereon, and a laser driver IC are provided. A silicon subassembly includes a silicon substrate with a pyramidal cavity etched into the substrate near its edge. A ball lens is precision-mounted in the pyramidal cavity by bonding it at multiple points. This provides a high-strength connection and a small, inexpensive silicon substrate. Also provided on the silicon substrate is a semiconductor luminescence element and a slit on the opposite side of the ball lens. The slit enables collimated light emitted from the ball lens to be optically coupled without being blocked or reflected by the substrate. The semiconductor luminescence element and its laser driver IC are placed in close proximity to each other, and ribbon wires are kept short (approximately 300 &mgr;m) to reduce signal line impedance mismatch for high-speed transmission.

Growing community of inventors

Yokosuka, Japan

Michihide Sasada