Kanegafuchi Chemical Industry Co., Ltd.

Kaneka Corporation

Michihide Homma

Hiroshi Wakabayashi

Masayuki Fujita

Katsuhiko Isayama

Atsuko Yoshihara

Hidetoshi Odaka

Takuya Maeda

Kiyotaka Bito

The present invention aims to provide a method for producing a polyalkylene oxide, which is capable of improving reduction in reactivity of a double metal cyanide complex catalyst in the case that a low molecular weight initiator is used, and producing the polyalkylene oxide with high productivity at low cost. The method for producing a polyalkylene oxide comprises carrying out a ring-opening addition reaction of an alkylene oxide with an initiator having at least one hydroxy group and having a molecular weight of not more than 300 per hydroxy group in the presence of a double metal cyanide complex catalyst in an organic solvent, wherein the organic solvent is used in an amount of 500 to 1,500 parts by weight relative to 100 parts by weight of the alkylene oxide used at the start of the reaction.

Process for producing polyalkylene oxide

This invention provides a curable composition capable of giving cured products drastically improved in resilience. This composition includes (A) an oxypropylene polymer having at least one silicon atom-containing group with a hydroxyl group or a hydrolyzable group bound to the silicon atom and having an Mw/Mn ratio of not more than 1.6 and a number average molecular weight of not less than 6,000, (B) an organic carboxylic acid salt of divalent tin and (C) an organic amine compound.

Curable oxypropylene polymer composition

Reactive silicon group-containing oxypropylene polymer and method of producing same

A two-pack type curable composition comprising:

Two pack type curable composition comprising epoxy resin and

A curable resin composition has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition, good chemical resistance and water resistance. This composition includes (A) an oxypropylene polymer having at least one silicon atom-containing group having a hydroxyl group or hydrolyzable group bound to the silicon atom and having an Mw/Mn ratio of up to than 1.6 and a number average molecular weight of at least 6,000, and (B) an epoxy resin.

Curable resin composition

A cured material of a curable composition comprising (1) an organic elastomeric polymer having at least one silicon-containing group to the silicon atom of which a hydroxyl group and/or a hydrolyzable group are bonded and which is cross linkable through formation of a siloxane linkage in a molecule, (2) an epoxy resin, (3) a curing agent for the epoxy resin and (4) a curing catalyst for the organic elastomeric polymer is firmly adhered to a substrate when a vinyl type polymer having at least one silicon-containing group to the silicon atom of which a hydroxyl group and/or a hydrolyzable group are bonded and which is cross linkable through formation of a siloxane linkage is coated on a substrate before application of the curable composition.

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Hyogo, Japan

Michihide Homma