Murata Manufacturing Co., Ltd.

Michiharu Yokoyama

Ryuken Mizunuma

Kaoru Sudo

Hideki Ueda

Masayuki Nakajima

Yoshiki Yamada

Hideaki Yamada

Shinichiro Banba

Nobumitsu Amachi

Noboru Morioka

Norikazu Fujii

An antenna module includes a dielectric substrate and a radiation element disposed on the dielectric substrate. The dielectric substrate includes a flat portion () and a flat portion () having mutually different normal directions, and a bent portion connecting the flat portion () and the flat portion () to each other. The flat portion () has a protruding portion partially protruding in a direction toward the flat portion () along the flat portion () from a boundary portion between the bent portion and the flat portion (). The flat portion () and the bent portion are connected to each other at a position where the protruding portion is not provided in the flat portion (). At least a part of the radiation element is disposed on the protruding portion.

Antenna module, communication device equipped with the same, and manufacturing method of antenna module

A wiring substrate for supplying a radio frequency signal to an antenna module having a first antenna element and a second antenna element includes a dielectric substrate having a laminated structure, a first power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the first antenna element, a second power supply wiring that is formed in the dielectric substrate and supplies a radio frequency signal to the second antenna element, and a ground conductor that is formed in a layer different from any one of a layer in which the first power supply wiring is formed and a layer in which the second power supply wiring is formed, and in which a hole portion is formed in a portion between the first power supply wiring and the second power supply wiring of the dielectric substrate toward the ground conductor.

Wiring substrate, antenna module, and communication device

A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.

Antenna-integrated type communication module and manufacturing method for the same

Wireless transmission/reception module

An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.

Antenna module and circuit module

Two high frequency antennas are provided in a multilayer substrate. Each high frequency antenna is configured of a radiation element, a high frequency power supply line, and a high frequency power supply unit. A low frequency antenna is configured of a series radiation element, a low frequency power supply line, and a lower frequency power supply unit. The series radiation element is formed of two radiation elements connected by a radiation element connection line. One end side of the series radiation element is connected to the low frequency power supply unit via the low frequency power supply line. Open stubs to block transmission of a high frequency signal (SH) are connected to the radiation element connection line and the low frequency power supply line. Short stubs to block transmission of a low frequency signal (SL) are connected to the high frequency power supply lines.

Growing community of inventors

Kyoto, Japan

Michiharu Yokoyama