Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Michiharu Torii

Nozomi Shimoishizaka

Takayuki Tanaka

Kouichi Nagao

Yoshifumi Nakamura

Junichi Ueno

Nobuyuki Koutani

A wiring board includes: a flexible insulating base; a plurality of conductive wirings arranged on the insulating base, end portions of the conductive wirings defining inner leads at a region where a semiconductor chip is to be mounted; and bump electrodes that are provided respectively at the inner leads of the conductive wirings. The wiring board further includes: dummy inner leads having a shape and a pitch corresponding to a shape and a pitch of the inner leads and aligned with the inner leads, the dummy inner leads being provided with dummy bump electrodes corresponding to the bump electrodes; a trunk conductive wiring provided for a group of one or an adjacent plurality of the dummy inner leads; and a branch wiring branching off from the trunk conductive wiring, the branch wiring being connected with the dummy inner leads belonging to the group corresponding to the trunk conductive wiring. Stress concentration on the inner leads during packaging of the semiconductor chip, resulting from the sparse arrangement of the electrode pads of the semiconductor chip, can be alleviated, thus suppressing a break in the inner leads.

Wiring board and semiconductor device using the same

A wiring board includes first and second feeding electrodes () provided along both sides of an insulating substrate (), feeding bus lines () extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings () having one side terminals forming inner leads having protruding electrodes () and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group. The inner leads () of the first group and the inner leads () in the dense pitch region of the second group are connected to the feeding bus line on one side of each region, and the inner leads () in the sparse pitch region of the second group are connected to the feeding bus line on the other side of each unit region. Non-uniformity of heights of the protruding electrodes due to a difference in the wiring pitches of the inner leads can be suppressed easily.

Wiring board and method for producing the same

A semiconductor device to be mounted on an external electronic device includes a film substrate on which wiring electrodes are formed, the wiring electrodes being partially covered with a covering member; and a semiconductor chip mounted on the film substrate. In this semiconductor device, the film substrate is folded so that at least one edge of the film substrate is on a side opposite to a side on which the semiconductor chip is mounted, and portions of the wiring electrodes exposed from the covering member on a surface of the film substrate on which the semiconductor chip is mounted are to be connected to electrodes of an external electronic device.

Semiconductor device with folded film substrate and display device using the same

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Shiga, Japan

Michiharu Torii