Hitachi, Ltd.

Hitachi Tobu Semiconductor

Other

Renesas Technology Corp.

Michiharu Honda

Kunihiko Nishi

Makoto Kitano

Ichiro Anjoh

Junichi Saeki

Shuji Eguchi

Isamu Yoshida

Shigeharu Tsunoda

Nae Yoneda

Kenichi Otsuka

Kazuya Ooji

Atsushi Nakamura

Toshio Sugano

Aizo Kaneda

Masayuki Watanabe

Seiichiro Tsukui

Yoshiaki Wakashima

Michio Tanimoto

Suguru Sakaguchi

Takeshi Komaru

Tohru Yoshida

Kohji Nagaoka

Kohji Serizawa

Mitsuhiro Suzuki

Akira Tanaka

Akira Yamagiwa

Kazuji Yamada

Toshio Hatada

Munehisa Kishimoto

Kosuke Inoue

Yuji Shirai

Takamichi Suzuki

Hitoshi Odashima

Hiroichi Shinohara

Toshihiro Okabe

Takao Ohba

Yoshitatsu Naito

Tsuyoshi Yamaguchi

Hitoshi Yoshidome

Tatsuya Yoneda

Tetsuo Murakami

Katsuhiro Iwashita

Kokichi Aomori

Katuhisa Tanaka

Izumi Hata

Asahi Tsuchiya

Kouji Sajiki

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold, which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Bump forming method and apparatus therefor

A semiconductor device-mounting construction including a semiconductor device having a plurality of electrodes formed on one main surface thereof. A printed circuit board having a writing pattern formed on one main surface thereof and a plurality of solder bumps interposed between the plurality of electrodes and the writing pattern to electrically connect the semiconductor device and the printed circuit board together. All of the voids, which are present in an interface of each of those of the plurality of solder bumps which are disposed closest to an outer peripheral edge of the semiconductor device, joined to the semiconductor device, are fine, and generally uniform in size.

Semiconductor device-mounting construction and inspection method therefor

In order to reduce a strain, developing in solder bumps in a BGA-type semiconductor device-mounting construction, so as to enhance a thermal fatigue life, voids, present in each solder bump joint portion of a BGA-type semiconductor device, are limited to a predetermined size, and a void of a large size, which would increase a strain to be produced, is eliminated.

Semiconductor device-mounted on a printed circuit board having solder

Method of manufacturing a semiconductor device having a ball grid array

Semiconductor device having a ball grid array package structure using a

A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.

Tape carrier package

There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.

Stacked semiconductor memory device and semiconductor memory module

A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

Semiconductor apparatus of module installing type

Semiconductor stacked device

Semiconductor device and semiconductor module with a plurality of

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Yokohama, Japan

Michiharu Honda