Dai Nippon Printing Co., Ltd.

Michiaki Uchiyama

Terutoshi Momose

Katsuya Sakayori

Shigeki Kawano

Tomoko Togashi

Hiroshi Yagi

Tsuyoshi Yamazaki

Hiroko Amasaki

Nobuhiro Sakihama

Tooru Serizawa

Makoto Shimose

Kazuto Okamura

Kazutoshi Taguchi

Kazunori Ohmizo

Youichi Nagai

Midori Chiba

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

Wet etched insulator and electronic circuit component

The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.

Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer&#x2014;insulating layer&#x2014;second inorganic material layer or a layer construction of inorganic material layer&#x2014;insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.

A magnetic head suspension includes an insulating base (), wiring parts () formed on one surface of the insulating base () including a conductive metal layer, an elastic metal plate () provided on the other surface of the insulating base (), and a wiring protecting layer () covering the wiring parts (). The wiring protecting layer () is formed by subjecting a dry film containing an epoxy resin, an acrylic resin and a polymer containing aromatic rings to exposure and developing processes.

Magnetic head suspension with both protected wiring and unprotected wiring, in addition to terminals

The present invention relates to a production process which, in the production of an electronic component by wet etching of an insulating layer in a laminate, is low in cost, does not use any organic solvent, which poses a problem of waste treatment. The production process of an electronic component comprises the steps of: wet etching a laminate of conductive inorganic material layer&mdash;insulating layer&mdash;conductive inorganic material layer or a laminate of conductive inorganic material layer&mdash;insulating layer to pattern the conductive inorganic material layer; and then performing wet etching to pattern the insulating layer. The patterning of the insulating layer by wet etching is carried out in a continuous form using a dry film resist; and, the dry film resist is laminated by roll pressing onto the laminate under a reduced pressure of not more than 80 KPa.

Production process of electronic component using wet etching, electronic component, and suspension for hard disk

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Shinjuku-ku, Japan

Michiaki Uchiyama