Fuji Xerox Co., Ltd.

Fujifilm Business Innovation Corp.

Fujifilm Corporation

Michiaki Murata

Takeshi Minamiru

Kenji Yamazaki

Shuichi Yamada

Tsutomu Otsuka

Kenichi Ono

Kumiko Tanaka

Masaki Kataoka

Mutsuya Takahashi

Hiroyuki Usami

Satoshi Inada

Yoshihisa Ueda

Takashi Kondo

Takahiro Hashimoto

Takafumi Higuchi

Norikuni Funatsu

Regan Nayve

Junichiro Hayakawa

Kazuyuki Oda

Toshimichi Iwamori

Hideyuki Ikoma

Atsushi Fukugawa

Jiro Minabe

Akira Sakamoto

Kazuhiro Sakai

Hideo Nakayama

Shinji Seto

Kazuhiro Hayashi

Katsumi Enomoto

Daisuke Iguchi

Atsuyuki Kitamura

Koichi Haga

Kazutaka Takeda

Akira Mihara

Takayuki Takeuchi

Koichi Saitoh

Nanao Inoue

Ichiro Tomikawa

Yoshinao Kondoh

Tomoaki Sakita

Hirokazu Matsuzaki

Toshinobu Hamazaki

Yasuhiko Maeda

Tomoki Umezawa

Masahiko Fujii

Taku Kinoshita

Hiroyuki Tsukuni

Naoya Kamigaito

Satoshi Tejima

Kohzo Hara

Koji Ikegami

Kunihito Satou

Hiroaki Tezuka

Shogo Komagata

Tsutomu Ishii

Kenichi Ohno

Shigetoshi Nakamura

A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.

Light emitter, light emitting device, optical device, and information processing apparatus

A light-emitting component includes a substrate, plural light-emitting elements that are disposed on the substrate and emit light in a direction intersecting with a surface of the substrate, and a gate electrode that is electrically connected to each of the plural light-emitting elements and performs control so that the plural light-emitting elements are switched ON/OFF together. Plural holes are disposed around each of the plural light-emitting elements.

Light-emitting component, light-emitting element array chip, and optical measurement apparatus

A light-emission device includes: a first light emitting element chip; a second light emitting element chip having a light output higher than a light output of the first light emitting element chip, the second light emitting element chip being configured to be driven independently from the first light emitting element chip and arranged side by side with the first light emitting element chip; and a light diffusion member including a first region provided on an emission path of the first light emitting element chip and a second region provided on an emission path of the second light emitting element chip, and having a diffusion angle at the second region larger than a diffusion angle at the first region.

Light-emission device, optical device, and information processing device

A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

Light-emitting element array chip, light-emitting device, optical device, and information processing device

A light emitting element array includes: a light emitting element group that includes plural light emitting elements; and plural lenses that are provided, corresponding to the plural light emitting elements, on a light emitting surface side of the plural light emitting elements, and that deflects light emitted from the plural light emitting elements according to a positional relation with the plural light emitting elements. Distances between central axes of light emission of the plural light emitting elements and central axes of the plural lenses corresponding to the plural light emitting elements increase from a center side of the light emitting element group toward an end side of the light emitting element group, and a degree of change in the distances decreases from the center side of the light emitting element group toward the end side of the light emitting element group.

Light emitting element array and optical measuring system

Provided is a method for manufacturing a semiconductor substrate including: preparing a semiconductor substrate having a front surface on which an epitaxial layer has been formed; and forming a fracture layer on a rear surface of the semiconductor substrate before forming elements on the epitaxial layer.

Method for manufacturing semiconductor substrate

A light irradiation device includes a light emitting unit, a cooling unit, a supply unit, and a driving unit. The light emitting unit emits light while generating heat. The cooling unit includes a channel through which a coolant flows, a first surface on which the light emitting unit is mounted, and a second surface that faces a direction opposite to the first surface. The supply unit is disposed facing the second surface in one direction that the second surface faces and supplies the coolant to the cooling unit. The driving unit is disposed facing the second surface in the one direction and includes a driving board that drives the light emitting unit.

Light irradiation device, light irradiation system, and image forming apparatus

A method for producing a semiconductor piece includes forming a first groove portion of a front-surface-side groove by anisotropic dry etching from a front surface of a substrate, forming a second groove portion of the front-surface-side groove, the second groove portion being located below and in communication with the first groove portion and having a width wider than a width of the first groove portion, and thinning the substrate from a back surface of the substrate up to the second groove portion. The second groove portion is formed by changing an etching condition of the anisotropic dry etching during the formation of the front-surface-side groove so that the width of the second groove portion is wider than the width of the first groove portion.

Method for producing semiconductor piece, circuit board and electronic device including semiconductor piece, and method for designing etching condition

Provided is a method for manufacturing a semiconductor chip including forming a groove on a front surface side along a cut area of a substrate, and a concave portion deeper than the groove on the front surface side as a positioning mark for a cutting member that performs cutting from a back surface of the substrate along the groove on the front surface side, thinning the substrate so as to reach the concave portion and not reach the groove on the front surface side, in the back surface of the substrate, positioning the cutting member from the back surface of the substrate by using the concave portion exposed on the back surface of the substrate as the positioning mark, and performing cutting from the back surface side of the substrate toward the groove on the front surface side of the substrate by using the positioned cutting member.

Method of positioning cutting member to semiconductor chip with grooves

A method of manufacturing a heating device includes preparing a substrate having a curved surface; and forming a heating body on the substrate, the heating body generating heat with a supply of electric current. The forming of the heating body includes pressing a screen toward the substrate with an aid of a pressing member while rotating the substrate and moving the screen, and transferring application liquid that is to form the heating body to the substrate through the screen. In the forming of the heating body, the pressing member is in contact with the screen at a position on an upstream side with respect to a transfer position in a direction of movement of the screen.

Method of manufacturing heating device by screen printing

A method for manufacturing a semiconductor chip includes forming at least a portion of a front-side groove by anisotropic dry etching from a front surface of a substrate along a cutting region; forming a modified region in the substrate along the cutting region by irradiating the inside of the substrate with a laser along the cutting region; and dividing the substrate along the cutting region by applying stress to the substrate.

Method for manufacturing semiconductor chip that includes dividing substrate by etching groove along cutting region of substrate combined with forming modified region by laser irradiating along cutting region in substrate

A semiconductor piece manufacturing method includes: a process of forming a groove on a front surface side including a first groove portion having a first width from a front surface of a substrate and a second groove portion that is positioned in a lower part that communicates with the first groove portion and has a second width larger than the first width; and a process of forming a groove on a rear surface side having a width greater than the first width along the second groove portion from a rear surface of the substrate by a rotating cutting member.

Semiconductor piece manufacturing method and substrate dicing method for suppressing breakage

A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

Method of manufacturing semiconductor chips

A semiconductor piece manufacturing method includes: a process of forming a fine groove on a front surface side including a first groove portion having a width that is gradually narrowed from a front surface of a semiconductor substrate W toward a rear surface thereof; a process of attaching a dicing tape having an adhesive layer on the front surface after the fine groove on the front surface side is formed; a process of forming a groove on a rear surface side having a width greater than the width of the fine groove on the front surface side along the fine groove on the front surface side from a rear surface side of the substrate by a rotating dicing blade; and a process of separating the dicing tape from the front surface after the groove on the rear surface side is formed.

Semiconductor piece manufacturing method

Growing community of inventors

Ebina, Japan

Michiaki Murata