Murata Manufacturing Co., Ltd.

Michiaki Iha

Masahiro Kubota

Shizuharu Watanabe

Hiroshi Takagi

Kazuhide Takata

Hiroaki Taira

Osamu Chikagawa

Hiromichi Kawakami

Makoto Tose

Toshikazu Oda

Akira Shiratori

Hiroyuki Kanbara

Yoshiyuki Tonami

Hideaki Nakai

Satoshi Miyayama

Yuji Sugiyama

Hiroaki Yamada

Shuuichi Towata

Shizuharu Waatanabe

Shizuharu Watanbe

Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(FeAl)Oin which 0&#x3c;x&#x3c;0.5.

Interconnector material, intercellular separation structure, and solid electrolyte fuel cell

A method for forming a thick film pattern forms a thick film pattern having a large thickness, a high hardness, and a high aspect ratio and exhibiting high dimension precision and high shape precision. In the method, a photosensitive paste including an inorganic powder, a photosensitive monomer, and a photopolymerization initiator and containing substantially no polymer is applied to a support so as to form a photosensitive paste film. The resulting photosensitive paste film is subjected to an exposure treatment and, thereafter, development is conducted so as to form a predetermined thick film pattern. Alternatively, a photolithography photosensitive paste including an inorganic powder, a photosensitive monomer, a photopolymerization initiator, and a polymer is used, wherein a ratio (weight ratio) of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer is about 0.86 or more.

Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste

A multilayer circuit component and a method for manufacturing the same, in which the difference of the amounts of baking shrinkages between each of the glass-containing layers is small, and the enlargement rate of the diameter of the via hole formed in each of the glass-containing layers is close to those in the other layers, so that it is possible to prevent a short circuit defect due to the mutual short circuit of the conductors in the via hole from occurring, and the warp of the substrate is reduced. The multilayer circuit component is provided with at least two glass-containing layers on a substrate, differentiating the softening temperature of glass compounded in the first glass-containing layer formed on the substrate from the softening temperature of glass compounded in the second glass-containing layer formed on the first glass-containing layer. The difference in the sintering properties due to the difference between the wettabilities is counterbalanced, and therefore, a multilayer circuit component, in which the warp of the substrate is reduced, and the degree of the enlargement of the via hole diameter of each of the glass-containing layers during baking is uniform, is produced.

Multilayer circuit component and method for manufacturing the same

A multilayer composite includes an insulating substrate and patterned conductive layers and insulating layers alternately laminated on the insulating substrate. In a laminating process, a correcting insulating layer is formed on a laminate when a predetermined number of layers are laminated or when a predetermined degree of warpage of the laminate is detected by monitoring. The correcting insulating layer has a different composition from that of the other insulating layers to correct the warpage of the laminate.

Multilayer composite and method for preparing the same

A photosensitive thick film composition is provided which has superior storage stabilities and can be reliably processed by developing. The photosensitive thick film composition is composed of a photosensitive organic component containing an organic binder having an acidic functional group, such as a carboxyl group, an inorganic component containing a polyvalent metal oxide, such as borosilicate glass, and an alcohol having a plurality of hydroxyl group, such as glucitol.

Photosensitive thick film composition and electronic device using the same

A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.

Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition

A photosensitive glass paste containing: an inorganic component containing a glass powder and a photosensitive organic component is provided. The glass powder contains about 1 to 30 percent by weight of a low melting point glass powder having a glass softening point in a range of about 400&deg; C. to 600&deg; C. and about 70 to 99 percent by weight of a high melting point glass powder having a glass softening point about 300&deg; C. or more higher than the glass softening point of the low melting point glass. As the high melting point glass, a borosilicate glass which inhibits diffusion of a conductive component such as Ag is employed. The content of the inorganic component in the photosensitive glass paste is in a range of about 40 to 70 percent by weight. A method of manufacturing a multilayered interconnected circuit board using the above-described photosensitive glass paste is also provided.

Photosensitive glass paste and method for manufacturing multilayered interconnected circuit board using the same

A method for forming a conductive pattern includes: applying a photosensitive conductive paste to a support to thereby form a film which paste contains an organic binder having an acidic functional group, a photosensitive organic component, a multivalent metallic powder, and a mono-ol compound having a boiling point of about 178&deg; C. or more, an anion-adsorbing material and/or a thixotropic agent; exposing and developing the film to thereby form conductive patterns and and transferring the conductive patterns and which are formed on the support onto a ceramic green sheet The invention also discloses a method for producing a ceramic multi-layer substrate.

Method for forming conductive pattern and producing ceramic multi-layer substrate

A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO , B O and K O such that the compositional proportions by weight of the three components represented by (SiO , B O , K O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.

Photosensitive insulating paste and thick-film multi-layer circuit substrate

There is disclosed a photosensitive conductive paste comprising a water- or alkali-soluble acidic-functional-group-containing organic binder, a photosensitive organic component, an organic solvent, a conductive powder such as iron or copper, and a mono-ol compound having a boiling point of about 178&deg; C. or higher such as dipropylene glycol monoethyl ether and/or a diol compound such as pentamethylene glycol. The photosensitive conductive paste has excellent storage stability and can be developed consistently.

Photosensitive conductive paste

There is disclosed a paste composition including (A) an organic binder comprising acidic functional groups; (B) an inorganic powder containing multivalent metal compounds; and (C) a mono-ol compound having a boiling point of about 178&deg; C. or more. The paste composition enables various fine patterns such as via-holes with high precision, by suppressing gelation caused by mixing an organic binder having acidic functional groups and a compound containing multivalent metals.

Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate

A conductive paste including an organic binder having an acidic functional group; an inorganic powder containing glass and/or ceramic; a conductive metallic powder; and a mono-ol compound having a boiling point of about 178.degree. C. or higher. At least one of the inorganic powder and the conductive metallic powder contains a multivalent metal. The paste is useful in the formation of a fine and minute thick-film conductive pattern having strong adhesion to a substrate.

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Otsu, Japan

Michiaki Iha