Jsr Corporation

Michiaki Ando

Masayuki Hattori

Nobuo Kawahashi

Tatsuya Shimizu

Hiroshi Shiho

Kazuo Nishimoto

Mibuko Shimada

Kenji Ishizuki

An aqueous dispersion for chemical mechanical polishing that is hard to putrefy, scarcely causes scratches, causes only small dishing and is suitable for used in a micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices, which dispersion comprises ceria particles, a preservative composed of a compound having a heterocyclic structure containing a nitrogen atom and a sulfur atom in the ring, such as an isothiazolone compound, and an organic component such as organic abrasive grains composed of resin particles, a dispersing agent composed of a water-soluble polymer having a specific molecular weight or the like, a surfactant and/or an organic acid or a salt thereof contained in an aqueous medium, wherein the ceria particles, preservative and organic component are contained in proportions of 0.1 to 20% by mass, 0.001 to 0.2% by mass and 0.1 to 30% by mass, respectively, when the total proportion of the aqueous medium, ceria particles, preservative and organic component is 100% by mass, and wherein the pH of this aqueous dispersion can be kept in a neutral range.

Aqueous dispersion for chemical mechanical polishing

An object of the present invention is to provide a composition for washing a polishing pad which removes a water-insoluble compound which was separated from a surface to be polished during polishing, formed at least on the surface of a polishing pad, and comprised a metal ion ionized, and a method for washing a polishing pad using the same. The composition for washing a polishing pad of the present invention is obtained by, in the case a water-insoluble compound is a copper quinaldinic acid complex, blending ammonia as a component for rendering the water-insoluble compound water-soluble and glycine as a water-soluble complex forming component for forming a water-soluble complex with a copper ion, and stirring them. In addition, in a method for washing a polishing pad using the composition for washing a polishing pad, a polishing pad can be washed effectively, the productivity can be improved and, further, consumption of a polishing pad can be inhibited.

Composition for washing a polishing pad and method for washing a polishing pad

Disclosed are a coating composition comprising a polymer dispersed in an aqueous medium, the polymer containing (a) a hydrolysate of an organosilane and/or a condensation product thereof and (b) a vinyl polymer containing a silyl group having a silicon atom bound to a hydrolytic group and/or a hydroxyl group, and further comprising (c) an oxazoline derivative as a crosslinking agent and a hardened film obtained therefrom. The above coating composition completes the hardening reaction of a coating film at low temperature for a short period of time, high in hardness immediately after hardening, and having water resistance, weather resistance, organic chemical resistance, acid resistance, alkali resistance, wear resistance and durable adhesion.

Coating composition and hardened film obtained therefrom

Growing community of inventors

Tokyo, Japan

Michiaki Ando