Intel Corporation

Michelle S Phen

James Chris Matayabas, Jr

Rajendra C Dias

Nisha Ananthakrishnan

Manish Dubey

Yiqun Bai

Rajen S Sidhu

Suriyakala Ramalingam

Yonghao Xiu

Martha A Dudek

Wei Tan

Hitesh Arora

Hsin-Yu Li

Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

Hybrid low metal loading flux

Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

Method for reducing underfill filler settling in integrated circuit packages

Growing community of inventors

Chandler, AZ, United States of America

Michelle S Phen