General Electric Company

Global Life Sciences Solutions USA LLC

Michelle Ann Parziale

Hendrik Pieter Jacobus De Bock

Colin R Tuohey

Ralph Stankowski

Joo Han Kim

Brian Patrick Hoden

Jerry L Wright

Alexander Mark Kilar

Prasad Bagiyanathan

Timothy J Becker

A circuit card assembly includes a first printed circuit board and a first electronic component mounted on the first printed circuit board. A heat transfer assembly is coupled to the first printed circuit board. The heat transfer assembly includes a first plate extending adjacent the first printed circuit board and a second plate extending adjacent the first plate. At least one of the first plate and the second plate includes an accommodation feature to accommodate the first electronic component. The heat transfer assembly further includes a first set of heat pipes between the first plate and the second plate. The first set of heat pipes is configured to remove heat from the first electronic component. At least one heat pipe of the first set of heat pipes extends adjacent the accommodation feature.

Circuit card assembly including heat transfer assembly and method of manufacturing such

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Madison, AL, United States of America

Michelle Ann Parziale