Verimetra, Inc.

Biosense Webster, Inc.

University of Oklahoma

Xactix, Inc.

Michele Migliuolo

Kyle S Lebouitz

Shiva Sharareh

Ariel Garcia

William Dongwook Suh

Hiroshi Nakagawa

Jennifer Rogers

A catheter with temperature sensing has a catheter body and a tip section with integrated thermoresistive temperature sensors on its outer surface. The temperature sensor includes a microfabricated thin film assembly of which one layer is a sensor layer of thermoresistive material. In one embodiment, the tip section has a flexible tubing on whose outer surface circumferential temperature sensors are integrated. In another embodiment, the tip section has a tip electrode on whose outer surface a tip temperature sensor is integrated. In yet another embodiment, the tip section has a tip temperature sensor integrated on its tip electrode and multiple circumferential temperature sensors distal of the tip temperature sensor.

Catheter with multiple microfabricated temperature sensors

A catheter with temperature sensing has a catheter body and a tip section with an integrated thermosistive temperature sensor on its outer surface. The temperature sensor includes a microfabricated thin film assembly of which one layer is a sensor layer of thermoresistive material. In one embodiment, the tip section has a flexible tubing with a temperature sensor on its outer surface. In another embodiment, the tip section has an extended tip electrode with a temperature sensor on its outer surface.

Catheter with microfabricated temperature sensing

A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor wafer not covered by the photoresist is removed and thereafter the photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a metal blade in a recess formed in said blade.

Method of making a cutting instrument having integrated sensors

An etching apparatus for etching semi combustion samples may include one or more variable volume expansion chambers, two or more fixed volume expansion chambers, or combinations thereof in fluid communication with an etching chamber and a source of etching gas, such as xenon difluoride. The apparatus may further include a source of a mixing gas. An etching apparatus may also include a source of etching gas, an etching chamber in fluid communication with the source of etching gas, a flow controller connected between the source of etching gas and the etching chamber, and a vacuum pump in fluid communication with the etching chamber. A source for providing a gas by sublimation from a solid material is also provided, including a vacuum tight container and a mesh mounted in the interior of the vacuum tight container, wherein the mesh is adapted to receive and restrain the solid material.

Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto

A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor wafer not covered by the photoresist is removed and thereafter the photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a metal blade in a recess formed in the blade.

Growing community of inventors

McMurray, PA, United States of America

Michele Migliuolo