Commissariat a L'energie Atomique

Michel Ravetto

Francois Marion

Jean-Louis Pornin

Francedillaois Marion

Jean-Louis Ouvrier-Buffet

Serge Valette

Gerard Destefanis

Jean Marine

Michelle Boitel

Jean-Paul Chamonal

Jean-Charles Cigna

Jean-Luc Tissot

Claudine Petitprez

Process for the exchange of a detection module hybridized by welding

The device includes at least two abutting detection elements (16, 18) having, on one face, a plurality of photodetectors (22, 24). A complementary detection element (26) has, on one face, a plurality of detectors (28) and is positioned astride the two abutting elements. The photodetectors of said complimentary element are positioned facing the faces of the two abutting elements and have no photodetector facing the photodetectors of the complementary element. The invention is useful in thermal imaging.

Radiation detection device having abutting detection elements and

Process for the hybridization and positioning of an optoelectronic component on a substrate and application of this process to the positioning of a laser diode with respect to an optical guide. This process consists of forming on the substrate at least one abutment (16), which determines by fitting in at least one notch (34) formed on the component to be hybridized, the lateral positioning of said component, forming shims (24) on the substrate (6), whose height fixes the vertical positioning of the component (2), the latter being provided with pads or studs (32) of a first material, forming studs or pads (26) of a second material on the substrate, forming on the pads of the second material a welding chip (28) made from a meltable material able to wet in the melted state the first and second materials and not the area round them, positioning the component in contact with the welding chip in such a way that the abutment (16) is fitted into the notch (34) and the welding chip (28) faces the pad not provided with a chip, raising the assembly to the melting point of the chips and bringing the assembly to a temperature below the melting point thereof.

Process for the hybridization and positioning of an optoelectronic

Method and machine to interconnect electric components by welding elements.

Method to interconnect electric components by means of solder elements

An assembly of parts forming an angle between facing surfaces of the parts and a process for producing an assembly is described. The parts (2, 4) are provided with contact elements or pads (6, 8, 10, 12) for connection to one another by means of a relatively low melting point metallic soldering material. The surface of each of the pads is wettable by the low melting point metallic material in the molten state, while areas surrounding the pads are not wettable. The contact pads of one of the parts are covered with flat coils or wafers (10, 12) of the low melting point metallic material. The wafers have the same thickness, but different volumes. The contact pads of the other part are placed on the corresponding wafers. The wafers' thickness, volumes, and spacing are chosen so that when the wafers are heated to the molten state and form truncated spherical drops due to surface tension, the parts form between them a predetermined angle. The invention has particular application to the manufacture of mirrors.

Assembly of parts forming an angle between them and process for

An electric connection of disconnection element is described as well as the corresponding connection or disconnection method and integrated circuits using such elements. The disconnection element consists of a disk or ingot joining two conductive tracks whose extremities are laid on wettable surfaces. Melting of the disk frees surface tension forces which separate its material into two balls centered on the wettable surfaces. The connection element is formed of two separate disks and, from the wettable surface pads, these disks are disposed opposite each other so that their material, once melted, unites to form a single droplet. A process is also disclosed for using these connection and disconnection elements for repairing defective integrated circuits.

Electric connection or disconnection element, integrated circuit

Measuring system constituted by a radiation detection circuit (3) welded to a reading circuit (2) by metal members (4), which is itself welded to a grooved cover (9) by other metal members (19). The cover (9) is placed on a cryostat cold finger (1) and a cavity (6, 10) contains the two circuits (2, 3). This arrangement obviates the need for bonding and welding electrical connection wires and therefore simplifies assembly, alignment and parallelism of the different parts.

Measuring system constituted by a radiation detection circuit, a reading

A layer of thickness x.sub.j is formed at the surface of a wafer of p-type ZnTe semiconductor material and compensated so as to provide insulation with high resistivity. Ions are implanted with sufficient energy to form a trapping region of thickness x.sub.1 at the surface of the semiconductor and to form beneath the trapping region an insulating region of thickness x.sub.3, with x.sub.1 &lt;x.sub.j. The diode has high efficiency both for emission of light having well-defined wavelengths and for current generation when subjected to light radiation.

Growing community of inventors

Seyssinet-Pariset, France

Michel Ravetto