Thomson-csf

Michel Prevost

Philippe Elleaume

Arnaud Du Chene

Patrick De Corlieu

The component-connecting device comprises several stacked and assembled wafers. Each wafer is made of an insulating material and includes conductive tracks that are rectilinear and parallel to one another. The tracks of two adjacent wafers are perpendicular. The tracks of the different wafers are made on a given side of the device. The device has zones for the connection of a component to that face, of the faces bearing the tracks, which is free, and these zones are electrically connected to tracks of other wafers. Finally, the tracks of the different wafers are extended as a connection zone with the exterior.

Component-connecting device and functional module for the use thereof

An integrated circuit for convolution type computations of the form ##EQU1## where j-i+k, and j and k are integers and i is a natural integer, C.sub.i being complex coefficients and X.sub.j being complex or real input data, for use in digital signal processing. A plurality of cells are connected in a sequence, all receiving simultaneously the input data; the complex coefficients are subsequently sent on a propagation bus to a cell first in the sequence of connected cells. Each cell includes a multiplier, and an adder accumulator, and a transfer circuit for transferring received coefficients to the next cell. In each cell, sequentially received coefficients are first used for computation and then transferred by the transfer circuit with a suitable delay. A logic device controls the time distribution and repetition of the real and imaginary parts of the input data. The cells alternately perform partial computations on the real and imaginary parts; the results, with a corresponding validations signal, are pooled by a pooling circuit and applied to a common results-framing and rounding circuit.

Digital computation integrated circuit for convolution type computations

An object of the invention is a device for interconnection between an integrated circuit and an electrical circuit, such as a printed circuit. This device has, depending on the desired interconnection, an insulating platelet or several, stacked insulating platelets. Each of the platelets is crossed by a pre-determined number of electricity conducting channels without offset and by a pre-determined, non-zero number of electricity conducting channels with an offset in the plane of the platelet and in a direction that is prefixed and proper to the platelet. Selected conduction routes are established by burning out the non-selected channels. The device is placed between the active face of the integrated circuit and the electrical circuit. The choice of the number of platelets of the device, of their respective orientations, and of the number of channels with and without offset within each platelet, enables any correspondence whatsoever to be achieved between the contact zones of the integrated circuit and the connection points of the electrical circuit. Another object of the invention is a method for the fabrication of a platelet of this device.

Device for interconnection between and integrated circuit and an

The invention pertains mainly to a reconfigurable computing device. The main object of the invention is a computer comprising redundant elements. The computer according to the present invention can function when there is a failure of one of the elements that constitute it. In this case, the redundant element takes the place of the malfunctioning element. Should the computer according to the present invention be in a critical stage, i.e. a situation where any interruption in computation would have serious consequences, the reconfiguring of the system is postponed to a later instant corresponding to the end of the critical stage. The invention applies mainly to the performing of digital computations.

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le Plessis Robinson, France

Michel Prevost