Mapper Lithography IP B.v.

Michel Pieter Dansberg

Guido De Boer

Pieter Kruit

Marco Jan-Jaco Wieland

Marcel Nicolaas Jacobus Van Kervinck

Jerry Johannes Martinus Peijster

Laurens Vincent Plandsoen

Alexius Otto Looije

Sjoerd Hesdahl

Joep Gerard Vijverberg

Jan Pieter Roelof Jongeneel

Bas Van Gelder

The invention relates to an assembly for enclosing a target processing machine. The assembly comprises an enclosure and a transfer unit. The enclosure comprises a base plate for arranging said target processing machine thereon, side wall panels, which are fixed to said base plate, and a top wall panel which is fixed to said side wall panels. In addition, the enclosure comprises an access opening in a side wall of the enclosure. The transfer unit comprising one or more transfer elements for moving the transfer unit with respect to the base plate. The transfer unit further comprises a door panel which is arranged for closing the access opening, wherein the door panel is movably mounted to the transfer unit by means of a flexible coupling which allows a movement of the door panel with respect to the transfer unit at least in a direction towards and/or away from the enclosure.

Enclosure for a target processing machine

The present invention relates to an apparatus and a method for transferring substrates into and from a vacuum chamber in a lithography apparatus. The load lock system comprises: a load lock chamber provided with an opening for allowing passage of a substrate in and out of the load lock chamber, and a transfer apparatus comprising a sub-frame at least partially arranged in the load lock chamber, an arm which is, with a proximal end thereof, connected to the sub-frame, and a substrate receiving unit which is connected to a distal end of the arm. The arm comprises at least three hinging arm parts, wherein a first and a second arm part are hingedly connected to the sub-frame with a proximal end thereof. A third arm part is hingedly connected to the distal ends of the first and second arm parts. The arm parts are arranged to form a four-bar linkage.

Load lock system and method for transferring substrates in a lithography system

The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target () such as a wafer, said target being included in said system by means of a target table (), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target () and target table (), a pressure drop (P) arises.

Lithography system, method of clamping and wafer table

The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target () such as a wafer, said target being included in said system by means of a target table (), clamping means being present for clamping said target on said table. Said clamping means comprises a layer or stationary liquid (), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target () and target table (), a pressure drop (P) arises.

The invention relates to a projection system for projecting one or more beams on a target, said system comprising a frame, a projection module comprising a beam source for providing the one or more beams, projection optics for projecting beams on the target, a target positioning module, comprising a carrier for carrying the target, a stage for carrying and positioning the carrier, a measurement system for determining a position of the projection module relative to the carrier, a controller adapted for controlling the target positioning module to position the target under the projection module based on said determined position, wherein the projection module is connected to the frame via a flexible coupling for dampening the propagation of vibrations from said frame to said projection module, and wherein the controller is adapted control the target positioning module to compensate for residual vibrations as measured by said measurement system.

Projection system with flexible coupling

The invention relates to a lithography system for patterning a target, said system comprising a feedback control system comprising an actuator for displacing the target, a measurement system for measuring a position of said target, and a control unit adapted for controlling the actuator based on the position measured by the measurement system, said feedback control system having a first latency being a maximum latency between measuring and controlling the actuator based on said measuring, a storage system for storing the measured positions, comprising a receive buffer and a storage unit with a second latency being an average latency between receiving measured positions in the receive buffer and storing said measured positions in the storage unit, wherein the first latency is at least an order of magnitude smaller than the second latency, the feedback control system comprising a unidirectional connection for transmitting said measured positions to the storage system.

Lithography system and method for storing positional data of a target

The present invention relates to a lithography system for projecting an image or an image pattern on to a target such as a wafer. Energy that is accumulated in the target by the projection of the image or image pattern is removed from said target, such that expansion by local and/or overall heating is limited to a relevant pre-defined value, and wherein such heat removal is realised by the use of a phase transition in a heat absorbing material that is brought into thermal contact with said target. As a further elaboration, such material may be applied in combination with a further material having a superior coefficient of heat transport, and may be incorporated in an emulsion comprising a material having a superior coefficient of heat transfer. Said material may e.g. be adhered to a bottom face of the target, and may also be included in a frame.

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Berkel en Rodenrijs, Netherlands

Michel Pieter Dansberg