Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Michel Pellat

Pierre Montmeat

Frank Fournel

Franck Fournel

Laurent Bally

This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.

Method for manufacturing a handle substrate for the temporary bonding of a substrate

There is provided a method for transforming an electronic device from an initial state, wherein the device includes a first substrate and a second substrate, the first and second substrates being joined by means of a bonding interfaced using their respective first faces, wherein the first substrate includes at least one cavity, produced using the first face of the first substrate, the cavity including a bottom bordered by at least one peripheral region and being at least partially filled with a buffer layer, in the bottom of the cavity, and wherein the first face of the second substrate is at least partly opposite the cavity of the first substrate. The method also includes a step of removing the bottom of the cavity of the first substrate from a first face, opposite to the first face of the first substrate.

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Grenoble, France

Michel Pellat