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L.c.c.-c.i.c.e.-compagnie Europeenne De Composants Electroniques

Transcal

Lcc.cice-compagnie Europenne De Composants Electroniques

Michel Lebailly

Bernard Lacruche

Xavier Dumant

Jean-Claude Taverdet

Maurice Jacquemin

Salim Dermarkar

A carrier for a printed circuit board or card on which electronic components are mounted, the carrier making it possible to disperse an increased quantity of heat given off by the components in the direction of an energy dissipating frame with which the carrier is in contact. The carrier comprises two flat parallel metal plates of identical perimeter defining between them a space which is entirely closed along the perimeter, the space containing a porous metallic material in contact with the plates, and being partially filled by a liquid which evaporates at the working temperature of the carrier.

Carrier for a card carrying electronic components and of low heat

An electronic device comprising at least one heat-generating electronic component and a passive electronic component in association with the heat generating component. The passive component comprises a porous preform of green silicon carbide or polygranular graphite, and a metal filling the porosities of the preform which can be aluminum, an aluminum alloy, magnesium or a magnesium alloy. The preform forms about 50 to 90% by volume of the passive component.

Electronic device including a passive electronic component

The present invention concerns a housing carrier for an integrated circuit. It comprises at least two rows of output conductors disposed at regular intervals on the periphery of a housing along a given pitch, these conductors presenting end parts extending from the housing with a view to electrically connecting the housing on an utilization circuit, and wherein the rows are staggered with respect to one another.

Housing carrier for integrated circuit

A package of the flatpack type for microelectronic circuits comprises a metal base of material having good heat conductivity on which a metal frame is mounted by means of a hard brazing alloy. The frame has the function of supporting connections by means of insulating lead-in bushings of the glass bead type. The coefficient of expansion of the frame and of the base are matched so as to ensure that the base of the package does not exhibit any defect of surface planarity after cooling.

Growing community of inventors

Bollene, France

Michel Lebailly