U.S. Philips Corporation

Michel J Monnier

Marc A Monneraye

Claude Foucher

Jean Philippe Hallais

Pierre Le Marchant

Jean-Claude Richard

The invention relates to a housing for an electronic device including a ceramic substrate 120 on which a multilayer circuit 110 is deposited by screen-printing. The circuit serves to bring about the connection between the terminals 7 of the electronic device and mounting pins 2 of the housing, which are provided in metallized holes in the substrate. The holes are provided with conducting rings (11 and 12) by means of screen-printing the conducting layers are formed from a compound which can be screen-printed and which comprises, at least, copper and a vitreous-crystalline material. This compound is to be fired in a neutral atmosphere at a temperature which is lower than the melting temperature of copper. Insulating layers are formed from a vitreous-crystalline screen-printable compound which must be fired in a neutral atmosphere at a temperature which is suited for the conducting layers with the insulating compound having a coefficient of expansion which is adapted to that of the substrate up to its firing temperature. The last layer of the circuit is a protective insulating vitreous-crystalline layer. The pins have the shape of a shank provided with a flat head, which flat head rests on the ring which is located at one of the faces of the substrate, and the pins are fixed by means of a metal alloy which is compatible with the metal coating of the holes and conducting rings with the melting temperature of the alloy being substantially the same or lower than the firing temperature of the circuit layers. The terminals of the electronic device located on the substrate are connected to the ends of the conductors by means of flexible wires, with the ends being left free during manufacture of the multilayer circuit. The electronic device is protectred by a cap.

Housing for an electronic device

Centering device for inserting pins in a multipin housing designed to receive an integrated circuit, whose pins are in the form of stems fitted with flat heads. The stem goes through a plane part, called the housing substrate, through holes which have first been metallized, with the pins protruding from one of the faces of the substrate by a length sufficient to ensure the fastening of the housing. The flat head bears upon the other face of the substrate via a metal preform of an alloy which is suitable for ensuring the fusion or melting for fastening the pins. This centering device consists of three parts. The first part is formed by a first metallic plate; the second part is formed by a second metallic plate used for calibrating the centering of the pins, said metallic plate being drilled with holes arranged in a geometrical pattern in compliance with the pattern chosen for the arrangement of the pins on the housing and calibrated so as to hold and to center the stems in the housing holes. The third part consists of a gripping device to lock the substrate of the housing fitted with its pins on the first metal plate. The materials chosen for the first metal plate have an expansion coefficient close to the expansion coefficient of the substrate of the housing in the temperature range at which the pins are to be fastened and this first metal plate is locked to the substrate of the housing during the fastening of the pins. Only the first metal plate is brought to this fastening temperature.

Centering device for inserting pins in a multipin housing

A method of manufacturing a moulded body, such as an aerial, of a plastic material covered with a metallic layer according to which an intermediate layer for facilitating removal from the mould has been previously formed on the surface of the mould. The metallic layer is deposited in the mould before the plastic material is introduced. The mould (3 and 4) is metallic, and the intermediate layer is formed by passivation of the metal. A metallic coating layer (15) is then deposited in the mould by an electrolytic method and the plastic material (50) is introduced into the mould thus prepared. Finally, after hardening of the plastic material removal from the mould is effected by applying a thermal treatment.

Method of manufacturing a body moulded from a plastics material and

A portable identifying element has the general shape of a laminated credit card, and comprises a front sheet (6), a central sheet (1) and a rear sheet (6'), all of plastic material. An active electronic circuit (3) is positioned within a cavity (2) of the central sheet. A thin layer of copper (7) is juxtaposed with the electronic circuit between the front sheet and rear sheet for removing heat dissipated within the circuit.

Portable, identifying element constructed as a lamination of sheets

The invention relates to a coupler for connecting optical fibers and electro-optical elements by means of a flexible polyimide substrate which is provided with a hole for positioning the fiber. The substrate is also provided with small metallized holes, covered with a metal bump, for connection of the electro-optical element.

Coupling device between optical fibers and electro-optical elements

Method of providing metal bumps on an apertured substrate and substrate having metal bumps.

Method of providing metal bumps on an apertured substrate

A method for manufacturing a lead-through of a metal element consisting of a fernico alloy through a component of ceramic material. A suspension is supplied of glass powder having molar percentage compositions within defined limits. The suspension is deposited on the ceramic material at the area of the lead-through and the assembly is heated for several minutes in an nitrogen atmosphere at a temperature near 1000.degree. C. followed by cooling of the assembly to room temperature.

Method of manufacturing a lead-through of a metal element through a

A window for an electron tube formed by a semiconductor device having a support of monocrystalline oxide, by a connection layer formed by a barium- or calcium-boroaluminate, by at least one passivating layer, and by an active layer having a constant composition and formed by a semiconductor material of the p-conductivity type.

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Montgeron, France

Michel J Monnier