National Instruments Corporation

Michel G Haddad

Alvin G Becker

James A Reimund

Rajesh Sukumaran

Charles T Yarbrough, Iii

Joseph E Peck

Mark R Wetzel

Darryl David Daniel

Christopher A Clark

Marc Marini

Al Becker

James P Koughan

Jason B Habingreither

Mark Silva

Bakul V Damle

A dimensionally flexible sparse matrix comprising multiple ports connected to a plurality of interconnected universal switches is disclosed. Each universal switch has at least three terminals and is switchable to connect any pair or all three terminals together. The plurality of interconnected universal switches are independently switchable to connect any one or more ports of the sparse matrix to any subset of the other ports. The sparse matrix may also be configurable to duplicate the connectivity of a variety of dimensionally different switch matrices by designating a first subset of the multiple ports as row ports and a second subset of the remaining ports as column ports with the added flexibility of connecting row-to-row and/or column-to column. The small physical size of signal stubs in the universal switches results in a signal path between any pair of terminals that may be suitable for the transmission of signal frequencies greater than approximately 500 mega-hertz.

Dimensionally flexible sparse matrix topology

A dimensionally flexible sparse matrix comprising multiple ports connected to a plurality of interconnected universal switches is disclosed. Each universal switch has at least three terminals and is switchable to connect any pair or all three terminals together. The plurality of interconnected universal switches are independently switchable to connect any one or more ports of the sparse matrix to any subset of the others ports. The sparse matrix may also be cofigurable to duplicate the connectivity of a variety of dimensionally different switch matrices by designating a first subset of the multiple ports as row ports and a second subset of the remaining ports as column ports with the added flexibilty of connecting row-to-row and/or column-to column. The small physical size of signals stubs in the univerals switches results in a signal path between any pair of terminals that may be suitable for the transmission of signal frequencies greater than approximately 500 mega-hertz.

Universal switch

In some embodiments, a mechanical adapter may be used to couple a first circuit board (e.g., a motherboard) to a second circuit board (e.g., a daughtercard) in a module. The mechanical adapter may have a mounting portion and a configurable portion. In some embodiments, the mounting portion may be similar for multiple configurations of the mechanical adapter. In various embodiments, the motherboard may be similar for different modules. For example, the mechanical adapter may be configured to mount a specific type of daughtercard in the configurable portion, while the mounting portion may be similar to mounting portions on other mechanical adapters with different configurations for different daughtercards (e.g., the motherboard may be similar for each of the different configurations). Therefore, in various embodiments, a common mounting portion may mate to a common motherboard configuration for different products each configured to mount a different daughtercard.

Mechanical adapter for circuitry modules

An instrumentation system which extends channel-based switched fabric architectures to provide instrumentation signaling functions. The system comprises a chassis including slots for receiving inserted modules. The chassis includes a backplane which provides for inter-module communication, including a channel-based switched fabric bus, such as the InfiniBand bus, and instrumentation signaling lines for instrumentation signaling functions. The signaling lines may include a local bus for adjacent slot communication of analog and/or digital signals, reference clock lines for transmitting system reference clock signals to synchronize operations of inserted modules, a trigger bus including trigger lines which connect to corresponding slots to communicate trigger signals between the inserted modules for synchronizing operations between the modules, and/or a star trigger bus including dedicated trigger lines connecting a star trigger controller slot to each instrumentation slot for communicating precision trigger signals generated by an inserted star trigger controller module to the inserted modules.

Instrumentation system including a backplane having a switched fabric bus and instrumentation lines

A system and method that configures a measurement device to a correct measurement range. The system and method implements an autoranging technique, preferably in software, that automatically determines a measurement range based on a measurement. Once an initial measurement is received, the initial measurement is compared with the current measurement range. If the current measurement range is the correct measurement range for the initial measurement, then the measurement device is already configured at the correct measurement range. However, if the current measurement range is found not to be the correct measurement range, then a new measurement range is determined based on the initial measurement. A new measurement is then taken using the new measurement range to ensure the new measurement range is the correct measurement range. The process repeats itself by comparing the new measurement with the new measurement range to see if the new measurement range, is the correct range. If the new measurement range is not the correct measurement range, then the process continues until a correct measurement range is found.

System and method for performing autoranging in a measurement device

A signal conditioning system which includes a low voltage analog bus and a high voltage analog bus. The signal conditioning system comprises a chassis having a plurality of slots, wherein each of the slots is adapted to receive a module. The chassis includes a low voltage analog bus and adapted for transmitting low voltage electrical signals. The chassis also includes a high voltage analog bus and adapted for transmitting high voltage electrical signals. Modules may be placed in slots of the chassis, wherein each module may connect through a connector to one or both of the low voltage analog bus and the high voltage analog bus. The high voltage analog bus allows for the conditioning (including switching) of high voltage electrical signals. In an alternate embodiment, the signal conditioning system may comprise a chassis which only includes a low voltage analog bus, i.e., the chassis does not include a built-in high voltage analog bus. For example the signal conditioning system may be an existing SCXI chassis which does not include a high voltage analog bus. In this embodiment, the system may include one or more rear connectors which are adapted to connect to one or more of the modules comprised in the chassis. The one or more rear connectors collectively form a high voltage analog bus for transmitting high voltage electrical signals between the one or more modules.

Signal conditioning system including low voltage and high voltage analog buses

Test system for detecting defective batteries

A method and apparatus for reducing the effects of ground loops in a thermocouple measurement device employing a differential amplifier for signal amplification. A resistor is coupled at the input of the differential amplifier to provide a DC ground reference. A capacitor is coupled in parallel to the resistor to compensate for AC noise and prevent the inputs from floating out of common mode range.

Thermocouple measurement device with improved input ground

An isolation system for allowing a single measurement circuit to measure both low and high voltage signals from separate low and high voltage buses, respectively, while maintaining substantial isolation protection for humans or animals potentially exposed to the low voltage bus. A central relay coupled to the measurement circuit selects between the low and high voltage buses and thus provide one level of isolation. Two mutually exclusive relays on either side of the central relay provide another level of isolation. Since the central and the two mutually exclusive relay are all rated at the basic insulation level, the low and high voltage buses are separated by at least two relay levels thereby meeting the double insulation or high voltage testing standard during normal operation. For additional protection, should one or more of the relays fail, dual spark gaps limit the maximum voltage to an intermediate voltage level. Clamp circuits further limit the voltage appearing on the low voltage bus to below the hazardous voltage level. The spark gaps protect the maximum voltage appearing across the clamp circuits and the clamp circuits further limit the maximum voltage across the low voltage bus. Furthermore, in-series fuses isolate the high voltage from the low voltage bus if the high voltage hazardous condition exists for a significant period of time. Thus, at least three levels of protection are provided.

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Austin, TX, United States of America

Michel G Haddad