Ge Aviation Systems Limited

Grumman Aerospace Corporation

General Electric Company

Northrop Grumman Systems Corporation

Bae Systems Information and Electronic Systems Integration Inc.

Michel Engelhardt

Nader Dariavach

Shushanna Rebecca Cherian-Brutus

Judd Everett Swanson

Paul Otto Stehlik

Richard Anthony Eddins

Liqiang Yang

Christopher Mouris Astefanous

Nicholas Ernest Williams

Ning Liu

John M Schiavone

Nicholas Williams

Darrell Lee Grimes

Lawrence Joseph Hannaford

Evgeny Dobin

Jr Hannaford Lawrence Joseph

A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

Heat sink assemblies for transient cooling

A method of fabricating an object by additive manufacturing is provided. The method includes irradiating a portion of powder in a powder bed, the irradiation creating an ion channel extending to the powder. The method also includes applying electrical energy to the ion channel, wherein the electrical energy is transmitted through the ion channel to the powder in the powder bed, and energy from the irradiation and the electrical energy each contribute to melting or sintering the portion of the powder in the powder bed.

Applying electric pulses through a laser induced plasma channel for use in a 3-D metal printing process

An apparatus and method relating to a cooling adapter having a housing with at least one mounting aperture and including at least one cooling manifold comprising an inlet plenum having at least one inlet for entry of a cooling fluid, an outlet plenum having at least one outlet for exhausting the cooling fluid, and a plurality of channels disposed between the inlet channel and the outlet channel for allowing the cooling fluid to move therebetween.

Cold plate assembly for an electronic component

A heat exchanger for cooling a component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Direct contact heat exchanger

A method and apparatus for heat-dissipation a structure having a first and second surface. The first surface defines a heat absorbing surface having a plurality of cavities and a heat absorbing coating applied to the first surface and within the cavities. Additionally, a set of etchings can be provided on the first surface to increase absorption. The cavities can be pyramidal, hexagonal, or conical shapes, for example.

Method and apparatus for heat-dissipation in electronics

Aspects of the disclosure generally relate to at least one device for heat transfer or dissipation. The at least one device for heat transfer or dissipation can include an air-to-air heat exchanger. The air-to-air heat exchanger can include an air flow inlet and various slots to establish a flow-through air path.

Electronic chassis with heat exchanger

A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.

Circular heatsink

An airflow generator () having a first plate (), a second plate () where the second plate () is spaced from the first plate () to define a cavity () there between, a joint () operably coupled to the first plate () and the second plate () and joining them together, piezoelectrics () located on each of the first plate () and the second plate () wherein actuation of the piezoelectrics () results in movement of the first plate () and the second plate () to increase the volume of the cavity () to draw air in () and then decrease the volume of the cavity () to push out the drawn in air ().

Airflow generator

A power electronic conversion system includes a first electronic component that generates heat; a mounting plate comprising a horizontal plate and a first vertical riser with vertical configuration, wherein the first vertical riser is configured to mount the first electronic component; a first thermal pad disposed between the first electronic component and the first vertical riser to reduce a contact resistance; and a cold plate coupled to the mounting plate and comprised at least one cooling medium passage defined by a plurality of internal fins.

Power electronic conversion system

A method and apparatus for heat-dissipation utilizing a fin assembly including one or more fins organized on a wall or base surface. The fins can extend into a flow of fluid passing along the wall or base surface to convectively cool the fins, which can transfer heat from heat-producing components, such as electronics.

A liquid cooling module for cooling an electronic component includes a housing supporting the electronic component, where the housing includes a cavity containing a cooling liquid. A liquid flow channel can be in fluid communication with the cavity and define a liquid cooling loop. A cold plate supporting the housing can have a cooling channel thermally coupled to the liquid flow channel.

Electronics cooling module

A liquid cooling circuit includes a liquid reservoir for coolant, a heat-generating module, a conduit fluidly coupling the heat-generating module with the liquid reservoir, and a pump configured to move the coolant through the conduit to cool the heat-generating module. The liquid cooling circuit is configured such that the movement of the coolant relative to the heat-generating module transfers heat from the heat-generating module to the coolant.

Growing community of inventors

Woodbury, NY, United States of America

Michel Engelhardt