Compagnie Europeenne De Composants Electroniques

Michel Dautriche

Michel Pageaud

A package for the encapsulation of an electronic component (50) includes a bottom (40), lateral faces (41) positioned around a main axis of the package and an open face (42) opposite the bottom (40). Each lateral face (41) includes guides (48) for guiding connection wires (45) of the component (50). These guides (48) are distributed evenly around the main axis of the package. The sides of the bottom (40) are equal.

Encapsulation package for electronic component

Disclosed is a foil capacitor made by the stacking of metallized films. The multiple-layer type output plate has intermediate layers made of alloys of the layers that are contiguous to them. Also disclosed is a method for the manufacture of the capacitor, wherein the intermediate layers are formed by the spraying of molten metal.

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Seurre, France

Michel Dautriche