Growing community of inventors

La Colle sur Loup, France

Michel Chomette

Average Co-Inventor Count = 2.88

ph-index = 5

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 102

Michel ChometteRobert J Mathews (2 patents)Michel ChomettePhilippe Patrice (1 patent)Michel ChometteDidier Elbaz (1 patent)Michel ChometteJohn M Horgan (1 patent)Michel ChometteDenise Brennan (1 patent)Michel ChomettePat White (1 patent)Michel ChometteBernard Calvas (1 patent)Michel ChometteGavin Warner (1 patent)Michel ChometteJean-Francois Vaccani (1 patent)Michel ChometteMichel Agoyan (1 patent)Michel ChomettePhilippe Tort (1 patent)Michel ChometteRemond Sautreau (1 patent)Michel ChometteColin Conlon (1 patent)Michel ChometteMichel Chomette (6 patents)Robert J MathewsRobert J Mathews (2 patents)Philippe PatricePhilippe Patrice (22 patents)Didier ElbazDidier Elbaz (10 patents)John M HorganJohn M Horgan (7 patents)Denise BrennanDenise Brennan (6 patents)Pat WhitePat White (5 patents)Bernard CalvasBernard Calvas (3 patents)Gavin WarnerGavin Warner (3 patents)Jean-Francois VaccaniJean-Francois Vaccani (2 patents)Michel AgoyanMichel Agoyan (1 patent)Philippe TortPhilippe Tort (1 patent)Remond SautreauRemond Sautreau (1 patent)Colin ConlonColin Conlon (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Texas Instruments Corporation (3 from 29,245 patents)

2. Gemplus (2 from 155 patents)

3. Molex Incorportated (1 from 1 patent)


6 patents:

1. 7448914 - Adapter for electrically connecting a miniature integrated circuit card in a memory card connector

2. 6672514 - Portable smart card reader assembly

3. 6166330 - Housing for an extended-format releasable plug-in card

4. 6028752 - Miniature device for receiving and playing back sound with piezoelectric

5. 5260512 - Sound-signal generator having ball-shaped housing with keyboard

6. 5235496 - Device for packaging integrated circuits

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as of
12/15/2025
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