Nortel Networks Corporation

Northern Telecom Limited

Michal Stefan Tencer

John S Moss

Michael Reginald Bishop

John Hanmer Watkins

Richard P Hughes

Richard J Glover

Richard S Kubin

Rodney David Pike

Kevin J Bailey

Vincent E Somoza

Sei S Hoe

Kevin L Dalgleish

Henry Wc Mok

William T Davies

Paul A Lindsay

Robert C Sheffield

Sorin Witzman

Gregory R Reinhart

Elizabeth M Tencer

The present invention relates to two modules containing electronic equipment, one relatively small, and one relatively large, that will be physically connected and used for extended operation in an environment where the ambient atmosphere contains moisture filled air or some other specified environmental contaminant. An absorber such as desiccant of a prescribed amount is contained within at least the relatively large module to control the absolute humidity and/or environmental contaminants within each module during extended operation in the ambient environment. Permeable wall portions are placed in the region between the relatively small module and the relative large module to allow for moisture and/or other specified environmental contaminants to pass from the relatively small module to the relatively large module. As such, the lifespan of the small module can be extended.

Enhanced humidity control for small modules

A passive method and packaging system for thermally controlling the temperature of electronic equipment within a housing are disclosed. The packaging system provides for two cooling steps, each of which uses a different passive cooling technology. Cooling by changing the phase of Phase Change Material, assists in controlling internal ambient temperatures by limiting the effects of short term localized thermal phenomena which would otherwise further increase internal temperatures. Cooling is also provided for by switching on a second passive cooling means, preferably a heat pipe, as the internal temperature of the housing increases above a predetermined temperature and to switch it off as the internal temperature drops below the predetermined temperature. Turning the second passive cooling means on and off provides respectively, a low or high thermal resistance path between the interior and exterior of the housing. The second passive cooling means allows for cooling of the housing above the predetermined temperature as well as heating of the housing below the predetermined temperature by preserving heat generated by the equipment. The two cooling steps in combination, co-operate to limit both maximum and minimum temperatures within the housing and of components. The combination of cooling steps also allows control over the temperature delta between the maximum and minimum temperatures during internal temperature swings.

Packaging system for thermally controlling the temperature of electronic

A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate. These microspheres are of a specified grid size and should also be sufficiently large to prevent glass microspheres from becoming trapped between the terminals of the component and of the substrate. The polymer adhesive has fluxing properties which enables it to be partially cured initially to hold the integrated circuit component in its required position, the curing action then being completed during a reflow soldering operation performed to join terminals of the component to the terminals of the substrate.

Process of assembling an integrated circuit and a terminal substrate

An EMI shield for a component mounted upon a printed circuit board. The shield is an open sided box made from plastic insulating material supporting an electrically conductive shield layer. A surrounding flange is provided by the plastic at the open side of the box, the flange having a surface facing outwards in the same direction as the open side. The conductive shield layer extends onto the outward facing surface.

Method of assembling an EMI shield around an electronic component

An outdoor wireless base station having a housing and a circuit pack extending upwards in the housing with electronic components extending into a forward air flow passage. The forward air flow passage is interconnected for air circulation with a rearward air flow passage and a heat conductive rear wall of the housing partly defines the rearward flow passage. Air in the forward air flow passage flows upwards and into the rearward air flow passage for heat removal through the rear wall. The cooling air flows downwards in the rearward air flow passage to return to the bottom of the forward air flow passage.

Wireless base station-having cooling passages

Growing community of inventors

Nepean, Canada

Michal Stefan Tencer