Robert Boschgmbh

Michaela Mitschke

Jochen Franz

Hubert Benzel

Helmut Grutzeck

Richard Fix

Heiko Stahl

Volkmar Senz

Arne Dannenberg

Uwe Schiller

Mike Schwarz

Zoltan Lestyan

Daniel Haug

Timo Lindemann

Tobias Sebastian Frey

Stefan Zehringer

Daniel Kaercher

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

A sensor element for a pressure sensor, includes a sensor membrane on which a defined number of piezoresistors are situated, the piezoresistors being configured in a circuit in such a way that, when there is a change in pressure an electrical change in voltage can be generated; at least two temperature measuring elements configured in relation to the sensor membrane in such a way that temperatures of the sensor membrane at positions of the piezoresistors can be measured using the temperature measuring elements, an electrical voltage present at the circuit of the piezoresistors due to a temperature gradient being capable of being compensated computationally using the measured temperatures.

Sensor element for a pressure sensor

Measures are described with the aid of which not only a rupture, but also cracks may be detected in the diaphragm structure of a micromechanical component with the aid of circuit means integrated into the diaphragm structure. At least some circuit elements are integrated for this purpose into the bottom side of the diaphragm, i.e., into a diaphragm area directly adjoining the cavern below the diaphragm.

Micromechanical component having a diaphragm

A micromechanical pressure sensor includes a first diaphragm and a second diaphragm accommodated in a shared semiconductor substrate. The two diaphragms facilitate independent pressure sensing of one or more media, by the fact that a respective pressure variable is sensed by way of the deflection of the respective diaphragm. A cap above the first diaphragm defines a hollow space that is connected to the hollow space below the second diaphragm.

Pressure sensor having a cap above a first diaphragm connected to a hollow space below a second diaphragm

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Reutlingen, Germany

Michaela Mitschke