Fujifilm Electronic Materials U.s.a., Inc.

Michaela Connell

Sanjay Malik

Ahmad A Naiini

Raj Sakamuri

Ognian N Dimov

Stephanie J Dilocker

This disclosure describes a process of generating a planarizing polyimide based dielectric film on a substrate with conducting metal pattern, wherein the process comprised steps of: (a) providing a dielectric film forming composition comprising at least one fully imidized polyimide polymer and at least one solvent; and (b) depositing the dielectric film forming composition onto a substrate with conducting metal pattern to form a dielectric film, wherein the difference in the highest and lowest points on a top surface of the dielectric film is less than about 2 microns.

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Cumberland, RI, United States of America

Michaela Connell