Advanced Micro Devices Corporation

Michael Zhuoying Su

Frank G Kuechenmeister

Vassilios Papageorgiou

Lei Fu

David Harry Eppes

Amado Ramirez

Gary A Cousins

Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.

Stacked semiconductor chips packaging

A technique for improving the thermal power dissipation of an integrated circuit includes reducing the thermal resistivity of the integrated circuit by increasing heat transfer in vertical and/or lateral directions. These results are achieved by increasing the surface area of the backside and/or the surface area of the lateral sides of the integrated circuit die. In some embodiments of the invention, an integrated circuit includes circuit elements formed closer to a first surface of a semiconductor substrate than to a second surface of the semiconductor substrate. The semiconductor substrate has a varying profile that substantially increases the surface area of a thermal interface formed on the second surface as compared to the second surface being substantially planar. A maximum depth of the profile is less than the thickness of the semiconductor substrate.

Integrated circuit with increased heat transfer

A test system configured to detect discontinuities in packaged devices. A test unit includes a pulse generator and a sampling circuit. The packaged device is coupled to the test unit via a test fixture. The test unit is configured to transmit a pulse to the packaged device through the test fixture, receive a reflected signal from the packaged device through the test fixture in response to the transmitted pulse, and analyze the reflected signal to detect a discontinuity within the packaged device and/or determine the location of a discontinuity within the packaged device. The test system is configured to store a calibration dataset which includes a set of sample values corresponding to a time domain reflectometry (TDR) test of a calibration packaged device. The test unit is configured to compare data corresponding to the reflected signal to stored values of the calibration dataset to detect a discontinuity in the packaged device.

Growing community of inventors

Round Rock, TX, United States of America

Michael Zhuoying Su