Intel Corporation

Stratolaunch, LLC

Michael Zack Eckblad

Thomas A Boyd

Casey R Winkel

Glen Patrick Gordon

Mark W Anderson

Chia-Pin Chiu

Russell S Aoki

James G Maveety

Eric Dwight McAfee

Ronald C Flamm

Rob W Sims

Ron Flamm

Brian R Peil

Correy D Cooks

Richard Zhao

Pardeep K Bhatti

Jeffrey J Sopko

Dan C Plitt

Andy F Thompson

Ronald B Sutherland

Uppalapati V Ramgopal

Erich K Weinberg

Michael A Lascu

Eryan Eylon

A joint that is separable by detonating a detonating cord within an expanding tube. The joint is held together with a set of bolts. Each bolt is retained on one side of the joint with a lever. The expanding tube is retained under an arm of each lever. When the detonating cord is activated, the tube expands and exerts a force against an arm of each lever, thereby breaking the set of bolts, and allowing the joint to separate. In one example, the separable joint is used to retain a payload fairing on a launch vehicle so that the fairing can be jettisoned during flight.

Controlled separation joint

In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.

Method for installing integrated circuit devices on a substrate

Integrated assembly for installing integrated circuit devices on a substrate

A method and an apparatus for releasably retaining a heatsink in contact with an IC attached to a circuitboard in which the heatsink is inserted into a spring cage that is pivotally connected with an actuation lever, wherein at least a pair of spring tabs engage the heatsink to press a thermal conductive surface of the heatsink towards a circuitboard and an IC attached to the circuitboard when the combination of the heatsink, actuation lever and spring cage are inserted into the rectangular frame of a retention module mounted on the circuitboard so as to surround the IC and the lever portion of the actuation lever is pivoted towards the spring cage so as to cause retention points on the actuator portions of the actuation lever and on the rectangular frame of the spring cage to engage corresponding retention points on the rectangular frame of the retention module.

High serviceability heatsink retainer method and apparatus

A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.

Mounting system for high-mass heatsinks

A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.

Heat dissipation device having a load centering mechanism

A system to connect cards in a chassis is provided. The system includes a chassis frame having a slot to receive a card. A rocker is coupled to the chassis frame and positioned in a closed state when the card is in the slot. A magnetic element is positioned on the rocker and a sensor positioned to detect a magnetic field generated by the magnetic element. The sensor then determines whether the rocker is positioned an open state or said closed state.

Hot swap system

An apparatus, and method for using same, is described for a distributed load board stiffener. The apparatus may include a body having a central axis portion and multiple protusions extending away from the central axis portion towards respective ends. Each of the ends of the protrusions having a mounting point to mount a printed circuit board to a chassis support. The protrusions may operate to mount the board stiffener to a printed circuit board away from trace routing areas disposed centrally on the printed circuit board. The protrusions may operate to distribute a load around a periphery of the printed circuit board.

Distributed load board stiffener

A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.

Heat sink mounting method and apparatus

A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or thermal pyrolytic graphite flakes. The carbon nanotubes and/or thermal pyrolytic graphite flakes are situated between a first surface and a second surface of the heat spreader, to transfer heat from a heat source (e.g., an electronic component) adjacent the first surface to, e.g., a heat sink adjacent the second surface when the heat spreader is incorporated in the assembly. The first surface has a smaller surface area than that of the second surface. Desirably, the carbon nanotubes and/or thermal pyrolytic graphite flakes are aligned extending between the first and second surfaces, and spread out in a direction from the first surface to the second surface, to provide more effective heat transfer and uniform spreading of the heat. The matrix material can be a metal or plastic, and can be compliant, flexible and soft to provide better thermal contact of the heat spreader with the electronic component and heat sink, even if surfaces are uneven, and to provide protection for fragile electronic components against shock and vibration and during structural loading.

Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader

A method and assembly for utilizing a gasket to protect an exposed die from damage, such as chipping and cracking, caused by external forces such as shock, vibrations, installation and/or handling, as well as to prevent electromagnetic interference (EMI) emissions from the exposed die.

Electro-mechanical heat sink gasket for shock and vibration protection and EMI suppression on an exposed die

A socket comprising an electrically conductive element, the element situated within a well such that a first end of the element extends above a first surface of the socket, the element capable of flexing to exert a first force on a pin inserted into the well upon application of a second force by a descending surface to the first end of the element.

Growing community of inventors

Auburn, WA, United States of America

Michael Zack Eckblad