Taiwan Semiconductor Manufacturing Comp. Ltd.

Michael Wu

Jiann-Tyng Tzeng

Fei-Yun Chen

Dah-Chuen Ho

Ching-Wen Cho

Eugene Chu

Yuh-Haw Chang

Eric Chao

Jih-Ren Tsai

A method comprising providing a first substrate and forming a first sacrificial layer over the first substrate, the first sacrificial layer comprising a curved surface portion, and forming a curved micromirror by depositing a reflective material over at the curved surface portion.

Concave and convex micromirrors and methods of making the same

A method for reducing a fluorine contamination level on a semiconductor wafer process surface including providing a semiconductor wafer surface having a process surface including an uppermost polyimide containing layer; reactive ion etching the process surface to include exposure of the process surface to a hydrofluorocarbon containing plasma; and heating the process surface according to a temperature profile to reduce a fluorine contamination level.

Method for reducing fluorine induced defects on a bonding pad surface

Growing community of inventors

Kaohsiung, Taiwan

Michael Wu