Wafer Solutions, Inc.

Michael Wisnieski

Michael R Vogtmann

Krishna Vepa

The present invention provides exemplary methods, systems and apparatus that provide improved substrate characteristics after grinding operations by avoiding or reducing overgrind damage to the wafers. In one embodiment, a grinding apparatus ( ) includes a first spindle ( ) having an eccentric-shaped abrasive matrix ( ) coupled thereto and a second spindle ( ) adapted to hold a substrate ( ) to be ground. The second spindle is offset from said first spindle such that the abrasive matrix passes through the substrate surface center ( ) for only a portion of the time during grinding operations.

Eccentric abrasive wheel for wafer processing

Exemplary methods, systems and apparatus are provided for accomplishing mixing of chemistries, such as those used in polishing materials used in semiconductor manufacturing. A manifold is provided that combines chemistries with a mixing element, for example, so that the stability of the chemical solution can be maintained so as to facilitate polishing. The mixing element can be oriented in a stationary position, or alternatively, it can be agitated.

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Pleasanton, CA, United States of America

Michael Wisnieski