Solexel, Inc.

Ob Realty, LLC

Other

Michael Wingert

Mehrdad M Moslehi

Pawan Kapur

Virendra V Rana

Sean M Seutter

Karl-Josef Kramer

Anthony Calcaterra

Thom Stalcup

David Xuan-Qi Wang

George D Kamian

Anand Deshpande

Gianluigi Mascolo

Jonathan D Albert

Yen-Sheng Su

K-Josef Kramer

Gerry Olsen

Sam A Cowley

Kamran Manteghi

Jeffrey F Boigenzahn

Steven J Coonen

A photovoltaic system comprises a photovoltaic module attached to a photovoltaic mount frame, the mount frame having a rectangular shape. A deflector is attached to the mount frame by a rotatable deflector and mount frame attachment wherein the deflector pivots around the rotatable deflector and mount frame attachment from a nesting position under the photovoltaic module in the mount frame to an installation position raising at least a first side of the mount frame. A mount foot is attached to the deflector by a rotatable mount foot and deflector attachment wherein the mount foot pivots around the rotatable mount foot and deflector attachment from a nesting position in a mount foot nesting indention in the deflector to an installation position planar to a mounting surface.

Photovoltaic module mounting and installation system

Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.

High-efficiency solar photovoltaic cells and modules using thin crystalline semiconductor absorbers

A back contact solar cell is described which includes a semiconductor light absorbing layer; a first-level metal layer (M1), the M1 metal layer on a back side of the light absorbing layer, the back side being opposite from a front side of the light absorbing layer designed to receive incident light; an electrically insulating backplane sheet backside of said solar cell with the M1 layer, the backplane sheet comprising a plurality of via holes that expose portions of the M1 layer beneath the backplane sheet; and an M2 layer in contact with the backplane sheet, the M2 layer made of a sheet of pre-fabricated metal foil material comprising a thickness of between 5-250 &#x3bc;m, the M2 layer electrically connected to the M1 layer through the via holes in the backplane sheet.

Metal foil metallization for backplane-attached solar cells and modules

According to one aspect of the disclosed subject matter, a method for forming a monolithically isled back contact back junction solar cell is provided. Emitter and base contact regions are formed on a backside of a semiconductor wafer having a light receiving frontside and a backside opposite said frontside. A first level contact metallization is formed on the wafer backside and an electrically insulating backplane is attached to the semiconductor wafer backside. Isolation trenches are formed in the semiconductor wafer patterning the semiconductor wafer into a plurality of electrically isolated isles and the semiconductor wafer is thinned. A metallization structure is formed on the electrically insulating backplane electrically connecting the plurality of isles.

Monolithically isled back contact back junction solar cells

A back contact solar cell comprises an active semiconductor absorber for use in a back contact solar cell having a light capturing front side and a backside opposite the light capturing front side. A first interdigitated metallization is positioned over the backside of the active semiconductor absorber. The first interdigitated metallization forming base and emitter contact metallization of the back contact solar cell. A backplane is positioned over the backside of the active semiconductor absorber and the first interdigitated metallization. A second interdigitated metallization is positioned over the backplane. The second interdigitated metallization is connected to the first interdigitated metallization for extracting photovoltaic power from the active semiconductor absorber. The second interdigitated metallization has base and emitter busbars over the backplane for electrical connection. An electronic component is electrically connected to at least a base busbar and at least an emitter busbar of the second interdigitated metallization. The electronic component has a bypass switch.

Smart photovoltaic cells and modules

Growing community of inventors

Milpitas, CA, United States of America

Michael Wingert