Medtronic, Inc.

Sapurast Research LLC

Freescale Semiconductor,inc.

Warsaw Orthopedic, Inc.

Michael William Barror

John K Day

Bernd J Neudecker

Shawn W Snyder

Joyce Yamamoto

Damon E Lytle

Alexandra Z LaGuardia

Kevin Thomas Foley

Gregory John Haubrich

David A Ruben

Nicholas M Benson

Richard L Brown

Mark E Henschel

Larry Earl Tyler

Newton Metcalf

William D Verhoef

Tyler S Stevenson

Douglas Dean Nippoldt

Quentin Scott Denzene

Clark B Norgaard

Robert S Wentink

James D Bradley

Tony A Ulrich

Calvert S Bontemps

Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

Sealed implantable medical device and method of forming same

A spinal implant includes an implant body including a first endplate and a second endplate. A plurality of electrodes include at least one electrode disposed with the first endplate and at least one electrode disposed with the second endplate such that the electrodes conduct an electric current to stimulate tissue growth adjacent the implant body. Systems, surgical instruments and methods are disclosed.

Spinal implant system and method

A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

Solid state power source with frames for attachment to an electronic circuit

An antenna for an implantable medical device (IMD) is provided that is formed on the same substrate as the telemetry circuitry for the IMD. The telemetry circuitry is formed on a portion of the substrate within the interior of a housing for the IMD, while at least one antenna is formed on an exterior portion of the substrate on the exterior of the housing to allow for far field telemetry. At least one electrical interconnect is formed on the substrate for connecting the antenna to the telemetry circuitry, where the electrical interconnect may comprise a controlled impedance line to minimize loss. A conformally-shaped hermetic cover, such as a ceramic material, may be formed in a desired shape around the exterior portion of the substrate and antenna and cofired together to form a monolithic structure encasing the antenna and exterior portion of the substrate.

Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same

System and method for making an antenna. An implantable medical device has a housing, a bobbin and a coil. The housing has an interior generally tubular cross-section with a longitudinal axis, the housing having a lateral portion of a segment of the tubular cross-section along the longitudinal axis. The bobbin has a first side nearest to the interior of the housing and a second side opposite the first side. The coil, wound around the bobbin on a winding axis orthogonal to the longitudinal axis of the tubular cross-section, has a greater number of complete turns proximate the second side of the bobbin than proximate the first side of the bobbin, with the coil having a cross-sectional shape selected for a space between the bobbin and the interior of the housing in the lateral portion of the segment of the tubular cross-section along the longitudinal axis of the housing.

Conformal antenna for implantable medical device and implantable medical device with such antenna

An implantable medical device ('IMD') is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.

External RF telemetry module for implantable medical devices

A method, device and software are disclosed which permit testing of both the optical portion and the electrical portion of an imaging device in a live bug configuration. Once an automated handler has positioned the device to be tested, the optical sensor on the image device is illuminated with electromagnetic radiation and electrical test signals are provided through the electrical pins on the integrated circuit package. These electrical and optical tests can be performed in sequence or simultaneously. The automated handler does not need to reposition or disengage from the device under test until both the electrical and optical tests are completed.

Method, apparatus and software for testing a device including both electrical and optical portions

Growing community of inventors

Gilbert, AZ, United States of America

Michael William Barror