Intel Corporation

Michael Wentling

Suresh V Golwalkar

Richard B Foehringer

Ryo Takatsuki

Shigeo Kawashima

Keiichi Tsujimoto

Nobuaki Sato

A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Dual sided integrated circuit chip package with offset wire bonds and

Manufacturing dual sided wire bonded integrated circuit chip packages

A method for constructing a dual sided integrated circuit chip package. A leadframe is formed comprising a set of die pads, and a set of lead fingers corresponding to each die pad. An integrated circuit die is disposed onto a first side and a second side of each die pad. Each integrated circuit die is wire bonded to the corresponding lead fingers. The temperature during the second side die attach and wire bonding steps is controlled and/or compatible materials are selected to prevent warping of the leadframe, and special steps are also implemented to eliminate mold flash, plastic mold cracking and overcuring and increasing the adhesion.

Method for constructing a dual sided, wire bonded integrated circuit

Growing community of inventors

Cameron Park, CA, United States of America

Michael Wentling