Infineon Technologies Ag

Sony Corporation

Michael Weber

Horst Theuss

Andreas Meckes

Manfred Schindler

Helmut Kiendl

Klaus Elian

Jochen Dangelmaier

Erhard Landgraf

Frank Daeche

Emanuel Stoicescu

Matthias Boehm

Johann Steger

Janis Weidenauer

Stefan Jahn

Robert Aigner

Bertram Gunzelmann

Volker Strutz

Simon Hainz

Holger Neuhaus

Stefan Paulus

Albert Auburger

Bernd Stadler

Xiaofeng Wu

Simone Fontanesi

Bin Yang

Martin Krüger

Wolfgang Schweiker

Franz Stegerer

Werner Hein

Guenter Ehrler

Frank Dāche

Günter Ehrler

A wheel sensor arrangement can include a first wheel speed sensor and a second wheel speed sensor. The first wheel speed sensor can include or be implemented with a first semiconductor die and can provide data regarding a speed of a rotating wheel. The second wheel speed sensor can also include or be implemented with a second semiconductor die and can provide data regarding the speed of the rotating wheel. The second semiconductor die can be galvanically isolated from the first semiconductor die. The wheel sensor arrangement can include a mold housing that forms around the first wheel speed sensor and the second wheel speed sensor. The mold housing can include a separation feature between the first sensor and the second sensor.

Systems and devices for wheel sensors

A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

Pressure sensor devices and methods for manufacturing pressure sensor devices

A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.

Magnetic-field sensor package with integrated passive component

A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.

Package with component connected at carrier level

A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

A device is disclosed. In one embodiment the device comprises a bias field generator configured to provide a magnetic bias field for a magnetic sensor, the bias field generator including a body comprising magnetic or magnetizable material, a packaged magnetic sensor accommodating the magnetic sensor and a recess disposed in the body, wherein the packaged magnetic sensor is arranged in the recess, and wherein the body includes two separate body parts, each body part include a part of the recess, and each body part is configured to hold in place the packaged magnetic sensor.

Bias field generator including a body having two body parts and holding a packaged magnetic sensor

A device for calculating an overall frequency-offset estimate from a plurality of frequency-offset estimates includes a receiver unit configured to receive a plurality of data streams, a phase shift estimation unit configured to generate a phase shift quantity representative of a phase shift over a number of consecutive data samples in the respective data stream, and a phase shift processing unit coupled to the phase shift estimation unit and configured to calculate a quantity related to the signal-to-noise ratio associated with a data stream on the basis of the respective phase shift quantity. Further, the device includes a frequency-offset estimation unit configured to generate frequency-offset estimates associated with the respective data streams, and a combiner configured to calculate an overall frequency-offset estimate on the basis of the frequency-offset estimates and on the basis of the quantities related to the signal-to-noise ratios.

Frequency-offset estimation

Receiver for Receiving Data Frames. According to one aspect, a receiver for receiving data frames which contain information data includes a signal input. Further, the receiver includes a data frame separator circuit for separating the signaling data from the information data. A switching device connects the data present at current input to a data output. A channel decoding circuit decodes the data which is present and generates signals which indicate whether the decoding has been carried out correctly. When correct decoding has taken place, a control circuit buffers all data and outputs a signal to the switching device to connect the buffered information data to the channel decoding circuit. When the signal indicates the correct decoding is received, the control circuit outputs the decoded information data.

Receiver

An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.

Electronic device with cavity and a method for producing the same

The invention relates to a method and to a device for identifying markers in data blocks. The method is characterized in that a number of data blocks () are received by a receiver () and one specific data block from the number of data blocks () is analyzed in order to determine whether the specific data block contains a marker () or not. Once a data block that contains a marker () is identified, a full-rate signaling block () that is transmitted at full rate and a half-rate signaling block () that is transmitted at half rate are searched for markers. A predetermined reference pattern is provided for correlation that is subsequently divided into sub-ranges that in turn are correlated with a predetermined reference pattern to identify a signaling frame in the full-rate signaling blocks () and/or the half-rate signaling blocks ().

Recognition of identification patterns

A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

An electronic component includes a semiconductor die which exhibits on its active top side above an active surface area a self-supporting electrically conductive cover layer which is supported by through lines and forms a hollow space to the active surface area. A method for producing the electronic component includes additional features.

Growing community of inventors

Mainburg, Germany

Michael Weber