Hutchinson Technology Corporation

Boston Scientific Scimed, Inc.

Other

Mound Laser & Photonics Center, Inc.

Michael Wayne Davis

Dean E Myers

Peter Francis Ladwig

Mark A Miller

Douglas P Riemer

Nathaniel K Behning

Paul Valentine Pesavento

Clark T Olsen

John A Theget

Ryan N Ruzicka

Kurt C Swanson

Bryan John Scheele

Joel B Michaletz

Timothy A McDaniel

Philip W Anderson

Michael P Meyer

Zachary A Pokornowski

Matthew S Lang

Daniel W Scheele

Andrew H Ashwill

Matthew D Crane

Jacob D Bjorstrom

Reid C Danielson

Yasushi Sakamoto

David R Swift

Steven R Lagergren

Patrick R LaLonde

James M Anderson

Robert B Evans

Brian J Brown

Derek C Sutermeister

Paul F Chouinard

Todd A Krinke

Benjamin Y Arcand

Timothy J Ley

Jay T Rassat

Raymond R Wolter

Craig A Leabch

James F Hemerick

David L Friesen

Duane M Jelkin

Galen D Houk

Thyna M Chau

Sean P Skubitz

Yiduo Zhang

David A Ziegler

Wade A Linnertz

Alan D Maki

Donald M Anderson

Brian Finander

Erich W Bierbrauer

Mark G Lowry

Ajay Sharma

Jeffery G Ribar

Joseph D Starkey

Keith D Johnson

Mohammed Kazemi

Steve Anderl

Kia Moh Teo

Russell J Bernard

Donald B McGregor

Beauregard J Gagnon

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Shape memory alloy actuators and methods thereof

A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

Miniature pressure/force sensor with integrated leads

A battery pouch is described. The battery pouch including an outer layer and an inner layer disposed on the outer layer. The inner layer including at least one sensor.

Sensored battery pouch

Shape memory alloy actuator

An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.

Component identification

Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.

Electrode tabs and methods of forming

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.

Shape memory alloy wire attachment structures for a suspension assembly

A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.

Wire feeding and attaching system for camera lens suspensions

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

Apparatus and method for forming sensors with integrated electrical circuits on a substrate

Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. According to various embodiments, the attachment structures include at least one of: an adhesive disposed proximate to a side of the attachment structures and between the attachment structures.

Shape memory alloy wire attachment structures with adhesive for a suspension assembly

Growing community of inventors

Rockford, MN, United States of America

Michael Wayne Davis