Teradyne, Inc.

Genrad, Inc.

Michael W Hamblin

Peter A Reichert

Joseph Francis Wrinn

Govindarajan T Srinivasan

Anthony J Suto

Gordon D Robinson

Dennis R LaFosse

Jak Eskici

Peter P Neihardt

Eric A Martens

According to one embodiment, a method for processing one or more X-ray images includes: receiving at least one image of the one or more X-ray images, the one or more X-ray images being of an assembly extending along a plane; based on the at least one image, autonomously determining a respective displacement value for each of portions of the assembly with respect to one or more directions of the plane, each of the displacement values being determined relative to a respective actual value; storing the displacement values; and applying a rule to the stored displacement values, the rule being for determining a defect status of the assembly.

X-ray inspection of solder reflow in high-density printed circuit board applications

According to one embodiment, a calibration system for calibrating image data produced by an imaging system is provided. The calibration system includes a processor configured for: receiving the image data from the imaging system; receiving a plurality of reference values from the imaging system; and calibrating the image data using the reference values. The reference values correspond to air image data produced by the imaging system.

Method of and system for calibration of inspection systems producing X-ray images

According to one embodiment, a system for linearizing image data corresponding to one or more objects and output by an imaging device is provided. The system includes a processor configured for: receiving the image data from the imaging device; and producing a generally linear relationship between the image data and a thickness of the one or more objects. The generally linear relationship is produced according to the equation I is an intensity of the image data, Iis an intensity of energy produced by the imaging device for outputting the image data, &#x3bc; is an attenuation coefficient of the one or more objects, and l is the thickness of the one or more objects.

Method of and system for obtaining linear data for object scanned using non-collimated, poly-energetic X-rays

A circuit-board-processing line ( ) employing various circuit-board-processing machines ( , and ) includes SMEMA-device emulators ( and ) interposed in the SMEMA channels between successive board-processing machines. Coordination circuitry ( ) receives from those emulators reports of the signals that they observe, and it controls various line machinery and other emulators in response. It similarly controls the emulators in response to information that it receives from various board-processing machines. In this way, the system is able to provide reporting and control features that the board-processing machines do not provide inherently.

Communications interface for assembly-line monitoring and control

Pin-driver circuitry in each of an automatic circuit tester (,)'s digital driver/sensor circuits (,) includes a current sensor (R,, QS,QS,D,and D,) and comparison circuit (,) that indicate whether the load current supplied by the driver exceeds a level set by a threshold input (CURRENT_VALUE). The pin-driver circuitry also includes a timer (,) whose output indicates whether the comparison circuit's output has been asserted for a length of time that exceeds a limit set by a duration input (TIME_VALUE). When it has, the tester disables the driver and thereby prevents damage that could otherwise result from excessive backdrive durations that the test-generation process did not anticipate. When no backdriving is sensed during a given burst of test signals, the tester forgoes the normal cool-down delay, thereby speeding the test process.

Circuit-board tester with backdrive-based burst timing

A system for detecting open circuits in connections between pins of an integrated circuit (IC) and traces on a circuit board on which the IC is mounted makes use of a-c paths inherent in the IC. An input signal is applied to a trace to which a pin of the IC is nominally connected. An internal a-c path in the IC carries the signal to another pin. Failure to detect an output signal derived from the input signal, above predetermined thresholds, at the trace to which the latter pin is nominally connected indicates failure of a pin-to-trace connection.

System for detecting faults in connections between integrated circuits

When an automatic circuit tester (10) detects that a fault has occurred in a circuit board (14), it applies to the circuit board (14) a sequence of vectors that differs from the test sequence (T.sub.n, T.sub.n+1) by which the fault detection occurs only in that each vector's component that corresponds to an input pin in question on the board device under test maintains a level that simulates an open circuit at that input pin. If the resultant response differs from the response to the original test sequence, the input pin can often be ruled out as one at which a fault has occurred. In this way, many open-circuit faults at input pins can be diagnosed without special probing, even when several such faults occur simultaneously.

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Stow, MA, United States of America

Michael W Hamblin