Hewlett-packard Development Company, L.p.

Other

Hewlett Packard Enterprise Development LP

Michael W Cumbie

Chien-Hua Chen

Scott A Linn

James Michael Gardner

Devin Alexander Mourey

Garrett E Clark

Anthony Donald Studer

Anthony M Fuller

Silam J Choy

Si-lam Choy

David N Olsen

Viktor Shkolnikov

Mark H MacKenzie

Sirena Chi Lu

Jefferson Patrick Ward

James Richard Przybyla

Galen P Cook

Stephen D Panshin

David Owen Roethig

Frank D Derryberry

Si-Iam J Choy

Richard W Seaver

Daryl E Anderson

Erik D Torniainen

George H Corrigan

Diane R Hammerstad

Robert N K Browning

Gary G Lutnesky

Berkeley Fisher

Stephen Farrar

Eric T Martin

Arun K Agarwal

Jeffrey R Pollard

Michael G Groh

Ning Ge

Jeffrey Allen Nielsen

Vincent C Korthuis

Hilary Ely

Adam Higgins

Si-Lam J Choy

Alexander N Govyadinov

Peter James Fricke

Randy Hoffman

Christie Dudenhoefer

Kenneth Ward

Brett E Dahlgren

Jeremy Sells

Sadiq Bengali

Paul David Schweitzer

Rachel M White

Robert K Messenger

Raymond G Beausoleil

Marco Fiorentino

Omer Gila

Pavel Kornilovich

Terrel L Morris

Charles Santori

Matthew Allen Shepherd

Adam L Ghozeil

Zhizhang Chen

Boon Bing Ng

James Elmer Abbott, Jr

Duane A Koehler

Greg Scott Long

Eric Lee Nikkel

David C Harvey

Chantelle Domingue

Matthew David Smith

Jong-Souk Yeo

Craig Olbrich

Roberto A Pugliese

Qingqiao Wei

Robert Newton Bicknell

Chaw Sing Ho

Jason Pelc

David J Benson

Reynaldo V Villavelez

Volker Smektala

Jose Luis Valero

Pere Esterri

Tod Woodford

Zhuqing Zhang

Amy Gault

Conrad Jenssen

Chien Hua Chen

Yee Kiat Ng

Michael Groom

Daren L Forrest

Guan Kwee Goh

John Edward Davis

Zhen Yi Li

Eric M Laplante

Robert N Browning

A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.

Print component with memory array using intermittent clock signal

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

Fluid ejection device with break(s) in cover layer

A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.

Die for a printhead

In some examples, a fluid dispensing device includes a fluid chamber, a heating element adjacent the fluid chamber, and an orifice adjacent the fluid chamber. A ratio of an area of a surface of the heating element to an orifice area of the orifice is greater than or equal to 3, where the surface of the heating element faces the fluid chamber.

Fluid dispensing devices with enhanced heating elements for non-aqueous fluids

In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.

Microfluidic devices

A fluid thermal processing device may include a substrate, a platform projecting from the substrate, a fluid heating element supported by the platform, a temperature sensing element, distinct from the fluid heating element, supported by the platform and an enclosure supported by and cooperating with the substrate to form a fluid chamber about the platform. The fluid chamber forms a volume of uniform thickness conforming to and about the platform.

Fluid thermal processing

A fluidic die including an array of fluid actuating devices addressable by a set of addresses, and an array of memory elements including a first portion to receive a first set of address bits representative of a first portion of an address of the set of addresses, and a second portion to receive a second set of address bits representative of a second portion of the address of the set of addresses. A first address driver is to provide a first portion of the address of the set of addresses based on the first set of address bits received by the first portion of memory elements, and a second address driver is to provide a remaining portion of the address of the set of addresses based on a second set of address bits received by the second portion of memory elements.

Integrated circuit with address drivers for fluidic die

A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Processes for formation of molded panels by bringing release liner of mold chase in direct contact with protective layer

An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.

Communicating print component

An integrated circuit includes a plurality of memory cells, an address decoder to select memory cells based on a data signal, activation logic to activate selected memory cells based on the data signal and a fire signal, and configuration logic to enable or disable access to the plurality of memory cells.

Integrated circuits including memory cells

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Molded structures with channels

An integrated circuit to drive a plurality of fluid actuation devices includes a status register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface, a data interface, and a fire interface. The control logic enables reading of the status register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface, and transitioning a signal on the fire interface to logic high with the signal on the single data interface floating.

Accessing registers of fluid ejection devices

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

Coplanar modular printbars

A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

Nozzle arrangements

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Corvallis, OR, United States of America

Michael W Cumbie