Intel Corporation

Michael W Beckman

Gary A Brist

Gary Baxter Long

William O Alger

Jayne L Mershon

The invention provides an optical connection between a component on a printed circuit board ('PUB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Connecting a component with an embedded optical fiber

A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.

Apparatus and method for an embedded air dielectric for a package and a printed circuit board

A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

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Portland, OR, United States of America

Michael W Beckman