Intersil Americas Inc.

Michael W Althar

Jian Yin

Steven R Rivet

Nikhil Vishwanath Kelkar

Francois Hebert

Loyde Milton Carpenter, Jr

Peter Oaklander

Nattorn Pongratananukul

Patrick J Selby

Steve Rivet

A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

Method of fabricating a circuit module

An embodiment of an apparatus includes first and second core regions, first and second conductors, and an isolation region. The first core region has a first permeability, and the first conductor is disposed in the first core region. The second core region has a second permeability, and the second conductor is disposed in the second core region. And the isolation region is disposed between the first and second core regions, and has a third permeability that is significantly different than the first and second permeabilities. For example, the first and second conductors may be windings of respective first and second inductors, and the isolation region, which may be attached to, or integral with, the first and second core regions, may reduce the amount of magnetic coupling between the inductors to a level that is negligible, such that the inductors may be used in applications that call for magnetically uncoupled inductors.

Inductor structure including inductors with negligible magnetic coupling therebetween

Embodiments disclosed herein provide for a circuit including first die having an active side and a backside, wherein the first die is flip-chip mounted to a carrier. The circuit also includes a second die stacked on the backside of the first die, wherein the second die is stacked on the first die such that a backside of the second die is facing the backside of the first die and an active side of the second die faces away from the first die.

Back-to-back stacked dies

An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.

Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides

Circuit module such as a high-density lead frame array (HDA) power module, and method of making same

Growing community of inventors

Melbourne, FL, United States of America

Michael W Althar