Kollmorgen Technologies Corporation

Kollmorgen Corporation

Michael Vignola

J Philip Plonski

Leonard Shieber

Benjamin G Chin

In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.

Method of making coaxial interconnection boards

This invention relates to a process for treating waste solutions and rinse waters, especially those from electroless plating processes to remove organometallic complexes and complexing agents, particularly copper and copper-EDTA complexes by eluting the waste solutions through anionic exchange resins.

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Bayville, NY, United States of America

Michael Vignola