Methode Electronics, Incorporated

Other

Michael V Stefaniu

John T Scheitz

Charles A Kozel

Kathleen A Capilupo

Raymond A Silbernagel

The present invention provides for a wire plug connector assembly where the individual wires are connectorized by forming a housing around the wires and capturing the terminal metallic potion of the wire by a ferrule which is received within an aperture of a receptacle for providing an electrical connection to a contact mounted therein. The plug may be formed of housing halves which are ultrasonically bonded to each other in order to capture the wires therein. The receptacle includes apertures with contacts which are enclosed at the rear face by hinged flaps in order to seal the rear face of the receptacle.

Wire connector assembly and method of forming same

A wire trap connector provides an adjustably mounted compression tail which protrudes from a contact within a housing of the wire trap connector. The compression tail is oriented at a right angle to one side of the connector housing or extends perpendicular from the connector housing. The invention thus allows a means of attaching wires to an electronic assembly without soldering the connector to the PCB. This provides the benefit of eliminating the soldering process from manufacturing. In addition, the compression tail offers alternate circuit assembly options to be used without the addition of a wave solder or manual solder step. Thus, the invention offers a significant cost reduction compared to current technology.

Wire-trap connector for solderless compression connection

An electrical connector is provided for forming a connection with a conductive pin. The electrical connector has a dielectric housing with both a passage extending through the housing and a chamber in communication with the passage. In addition, the electrical connector has a metal contact with a mating end disposed in the housing's chamber and a solder tail which projects from the housing. The mating end of the contact consists of a clamping stirrup which has a bottom area with a hole disposed therein for receiving the conductive pin. Furthermore, the contact is three dimensionally secured to the connector housing via a press-fit.

Low profile electrical connector

A miniature shunt connector for commoning a pair of adjacent terminal posts and a method for commoning a pair of adjacent terminal posts are provided. The shunt connector includes a housing formed of an insulating material which forms an internal contact cavity configured to receive an electrical shunt contact. A pair of terminal post receiving apertures communicate with the contact cavity to allow terminal post to be inserted therein. A surface feature is also formed in a wall of the contact for locking said contact element into said housing. An electrical shunt contact element is provided and configured to fit within the internal shunt cavity. The contact element is formed with two rear contact beams and two resilient front contact beams. The resilient front contact beams being provided with and anti-overstress feature in the form of flared ends configured to physically engage the contact housing. A shunt portion of the contact element provides an electrical short circuit between the contact beams.

Miniature shunt connector with anti-overstress contact element and

A zero insertion force pin grid array socket includes a cover slidably engaged to a base and having an array of holes formed therethrough. The base has an array of corresponding passages, the passages receiving pins of an IC package inserted through corresponding holes of the cover. Contacts are mounted within the passages and include a generally tuning-fork shaped contact having torsional beams which deflect the insertion forces of the pin of the IC package which have a surface area of at least forty percent of the entire surface area of contacts. The contacts include wiping areas which are plated which have a surface area of less than an eightieth of the entire surface area of the contact. The socket cover includes a means for providing an air-gap between the socket cover and the IC package.

Zero insertion force pin grid array socket

A zero insertion force pin grid array socket includes a cover slidably engaged to a base and having an array of holes formed therethrough. The base has an array of corresponding passages, the passages receiving pins of an IC package inserted through corresponding holes of the cover. Contacts are mounted within the passages and include a generally tuning fork shaped contact having beams which deflect the insertion forces of the pin of the IC package which have a surface area of at least forty percent of the entire surface area of contacts. The contacts include wiping areas which are plated which have a surface area of less than an eightieth of the entire surface area of the contact. The socket cover includes a means for providing an air-gap between the socket cover and the IC package.

A chip carrier socket comprises a frame which defines and surrounds a space for receiving a chip carrier. A plurality of elongated contacts are carried by the frame, the contacts each defining a first section which resides within the inner surface of the frame, and are positioned to conductivity engage peripheral contacts of a chip carrier carried in the space. The contacts also each define a second section positioned on one side of the chip carrier socket to engage conductive members of a circuit board when the socket is carried thereon. The second sections each define a contact end which projects inwardly. The chip carrier socket defines an open aperture within and through the frame adjacent the inner surface so that the inwardly projecting contact ends are visible while the socket is carried on a circuit board.

Growing community of inventors

Lake Zurich, IL, United States of America

Michael V Stefaniu