Raytheon Company

Other

Michael V Liguori

Sean P Kilcoyne

Michael J Rondon

Eric R Miller

Robert M Emerson

Shannon F Wilkey

Interconnects and methods of fabricating a plurality of interconnects. The method includes depositing a conformal layer of a plating base in each of a plurality of vias, and depositing a photoresist on two portions of a surface of the plating base outside and above the plurality of vias. The method also includes depositing a plating metal over the plating base in each of the plurality of vias, the depositing resulting in each of the plurality of vias being completely filled or incompletely filled, performing a chemical mechanical planarization (CMP), and performing metrology to determine if any of the plurality of vias is incompletely filled following the depositing the plating metal. A second iteration of the depositing the plating metal over the plating base is performed in each of the plurality of vias based on determining that at least one of the plurality of vias is incompletely filled.

Iterative formation of damascene interconnects

A method is provided to fabricate a wafer including a bonding layer interposed between a device wafer and a handle wafer. The method includes performing a first deposition process to deposit an ultraviolet (UV) shield layer on a backside surface of the handle wafer. A second deposition process is performed to deposit a stress compensation layer on an exposed surface of the UV shield layer. The UV shield layer blocks UV energy generated while performing the second deposition process from reaching the bonding layer.

Ultraviolet radiation shield layer

Disclosed herein are interconnects and methods of fabricating a plurality of interconnects. The method includes depositing a conformal layer of a plating base in each of a plurality of vias, and depositing a photoresist on two portions of a surface of the plating base outside and above the plurality of vias. The method also includes depositing a plating metal over the plating base in each of the plurality of vias, the depositing resulting in each of the plurality of vias being completely filled or incompletely filled, performing a chemical mechanical planarization (CMP), and performing metrology to determine if any of the plurality of vias is incompletely filled following the depositing the plating metal. A second iteration of the depositing the plating metal over the plating base is performed in each of the plurality of vias based on determining that at least one of the plurality of vias is incompletely filled.

Systems and methods of in-situ calibration of semiconductor material layer deposition and removal processes are disclosed. Sets of test structures including one or more calibration vias or posts are used to precisely monitor processes such as plating and polishing, respectively. Known (e.g., empirically determined) relationships between the test structure features and product feature enable monitoring of wafer processing progress. Optical inspection of the calibration feature(s) during processing cycles permits dynamic operating condition adjustments and precise cessation of processing when desired product feature characteristics have been achieved.

In-situ calibration structures and methods of use in semiconductor processing

An object memory management system (OMMS) provides a communications link between a plurality of various types of inputs and a plurality of customers who would normally receive one or more of the various types of inputs. Included among the input signal devices are GPS, infrared (IR), photo cell, range finder, and other type sensors, and signal sources such as data bit stream, pulsed digital signals, verbal and visual signals. Included among the customers are artificial intelligence (AI) and software service providers. The system recognizes a received incoming signal, converts it into a signal the designated customer can recognize and sends it to the designated customer. Signals are processed on a first-in-first-out (FIFO) basis unless a priority designation is received. Complex incoming signals (verbal and visual) require pattern recognition wherein an object database is utilized to understand such incoming signals.

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Beullton, CA, United States of America

Michael V Liguori