Leonhard Kurz Stiftung & Co Kg

Michael Triepel

Konstantin Kosalla

Klaus Pforte

Ljubisa Drinic

Ralf Friedmann

Thomas Meier

Ralph Bieber

A device for the surface treatment of a substrate including a transport device, a vacuum suction device, a corona device and a coating device, is described. The transport device is formed as a conveyor belt. The conveyor belt is formed as a vacuum suction belt of the vacuum suction device, and the conveyor belt is formed as a counter electrode of the corona device.

Device for the surface treatment of a substrate, comprising a metallic conveyor belt

A method for applying a transfer ply of a foil to a substrate, with the steps of:

Method and application device for applying a transfer layer of a film to a substrate

A film-embossing apparatus with a hot-embossing device which has a heated embossing stamp. With the formation of a contact pressure, a transfer layer, arranged on a carrier film, of a hot-embossing film is transferred to a surface of a workpiece. The hot-embossing device has control inputs and outputs. The film-embossing apparatus has an industrial robot with control inputs and outputs. The control inputs and outputs of the hot-embossing device and of the industrial robot are connected to a control unit. The industrial robot is formed such that it guides the workpiece to the hot-embossing device, positions the workpiece on the embossing stamp, guides the workpiece past the embossing stamp, and guides the embossed workpiece away from the hot-embossing device. The industrial robot can also position the hot-embossing device on the workpiece.

Film-embossing apparatus

A hot-stamping device () is described, having a stamping device () for transferring a transfer layer () disposed on a carrier layer () of a hot-stamping foil () on to a substrate (). The hot-stamping device comprises a heatable stamping roller () and a counter-pressure roller (), between which a stamping gap () is realized, and comprising a separating device (), disposed downstream, for separating the carrier layer () from the transfer layer () transferred on to the substrate (). A flat support element () is disposed under the stamped substrate (), between the stamping gap () and the separating device (), directly adjoining the stamping gap () or at a distance of &#x3c;1 mm from the stamping gap () or overlapping the stamping gap ().

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Furth, Germany

Michael Triepel