Hewlett-packard Development Company, L.p.

Michael Thornton

David William Mayer

A system having a power module mount adapted to support a power module side-by-side with a card-based processor, and a connectivity guide adapted to guide the power module along a direct path between electrically connected and disconnected relationships with the card-based processor. A method for mounting a power module to a processor involving engaging the power module with a connectivity guide disposed adjacent the processor, moving the power module toward the processor via the connectivity guide, and mating edge connectors of the power module and the processor.

Growing community of inventors

Loveland, CO, United States of America

Michael Thornton