International Business Machines Corporation

Globalfoundries Inc.

Michael T Brigham

Eric Jeffrey White

Anthony K Stamper

Christopher Vincent Jahnes

William Joseph Murphy

Jeffrey C Maling

Cameron E Luce

Matthew T Tiersch

Jason P Ritter

Graham M Bates

Eva A Shah

Joseph K Comeau

Donald Francis Canaperi

Mahadevaiyer Krishnan

Michael F Lofaro

William J Cote

Kenneth M Davis

James Anthony Tornello

Scott Alan Estes

Michael A Cobb

Edward Jack Gordon

Michael Joseph MacDonald

James Hannah

Dean Allen Schaffer

George James Slusser

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both tungsten material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

Micro-electro-mechanical system (MEMS) structures and design structures

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming a Micro-Electro-Mechanical System (MEMS) beam structure by venting both metal material and silicon material above and below the MEMS beam to form an upper cavity above the MEMS beam and a lower cavity structure below the MEMS beam.

Micro-Electro-Mechanical System (MEMS) structures and design structures

Method for forming micro-electro-mechanical system (MEMS) beam structure

A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.

Slurry for chemical-mechanical polishing of metals and use thereof

A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.

Slurry for chemical-mechanical polishing of copper and use thereof

Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.

Slurry for mechanical polishing (CMP) of metals and use thereof

Growing community of inventors

Bolton, VT, United States of America

Michael T Brigham